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DAC7578 Datasheet(PDF) 2 Page - Texas Instruments |
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DAC7578 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 55 page DAC5578 DAC6578 DAC7578 SBAS496A – MARCH 2010 – REVISED AUGUST 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) MAXIMUM MAXIMUM RELATIVE SPECIFIED DIFFERENTIAL PACKAGE- PACKAGE PACKAGE PRODUCT ACCURACY TEMPERATURE NONLINEARITY LEAD DESIGNATOR MARKING (LSB) RANGE (LSB) TSSOP-16 PW DAC7578 DAC7578 ±1 ±0.25 –40°C to +125°C QFN-24 RGE DAC7578 TSSOP-16 PW DAC6578 DAC6578 ±0.5 ±0.5 –40°C to +125°C QFN-24 RGE DAC6578 TSSOP-16 PW DAC5578 DAC5578 ±0.25 ±0.25 –40°C to +125°C QFN-24 RGE DAC5578 (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. DAC5578, DAC6578, DAC7578 UNIT AVDD to GND –0.3 to +6 V Digital input voltage to GND –0.3 to +AVDD + 0.3 V VOUT to GND –0.3 to +AVDD + 0.3 V VREFIN to GND –0.3 to +AVDD + 0.3 V Operating temperature range –40 to +125 °C Storage temperature range –65 to +150 °C Junction temperature range (TJ max) +150 °C Power dissipation (TJ max – TA)/qJA W (1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. THERMAL INFORMATION DACx578 THERMAL METRIC(1) UNITS PW (16 Pins) RGE (24 PINS) qJA Junction-to-ambient thermal resistance 111.9 33.7 qJCtop Junction-to-case (top) thermal resistance 33.3 16.9 qJB Junction-to-board thermal resistance 52.4 7.4 °C/W yJT Junction-to-top characterization parameter 2 0.5 yJB Junction-to-board characterization parameter 51.2 7.1 qJCbot Junction-to-case (bottom) thermal resistance n/a 1.7 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): DAC5578 DAC6578 DAC7578 |
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