2

FN6640.1

September 11, 2008

Pin Descriptions

24 LD TQFN

PIN NAME

EQUIVALENT

CIRCUIT

DESCRIPTION

1

IN+_2

Circuit 1

Amplifier 2 non-inverting input

2

IN+_3

Circuit 1

Amplifier 3 non-inverting input

3

GND_IN(1, 2, 3)

Circuit 4

Common reference input for Amplifiers 1, 2, 3

4EN(4, 5, 6)

Circuit 2

Enable pin internal pull-down; Logic “1” selects the disabled state; Logic “0” selects

the enabled state. Channels 4, 5, 6

5

V+(4, 5, 6)

Circuit 5

Positive power supply for Channels 4, 5, 6.

6

IN+_4

Circuit 1

Amplifier 4 non-inverting input

7

IN+_5

Circuit 1

Amplifier 5 non-inverting input

8

IN+_6

Circuit 1

Amplifier 6 non-inverting input

9

GND_IN(4, 5, 6)

Circuit 5

Common reference input for Amplifiers 4, 5, 6

10

GND_PWR(4, 5, 6)

Circuit 5

Power supply ground for Channels 4, 5, 6.

11

GND_OUT(4, 5, 6)

Circuit 3

Output power supply ground for Channels 4, 5, 6.

12

OUT_ 6

Circuit 3

Amplifier 6 output

13

OUT_ 5

Circuit 3

Amplifier 5 output

14

OUT_4

Circuit 3

Amplifier 4 output

15

V+_OUT(4, 5, 6)

Circuit 3

Output power supply for Channels 4, 5, 6.

16

GND_PWR(1, 2, 3)

Circuit 4

Power supply ground Channels 1, 2, 3.

17

GND_OUT(1, 2, 3)

Circuit 3

Output power supply ground Channels 1, 2, 3.

18

OUT_3

Circuit 3

Amplifier 3 output

19

OUT_2

Circuit 3

Amplifier 2 output

20

OUT_1

Circuit 3

Amplifier 1 output

21

V+_OUT(1, 2, 3)

Circuit 3

Output power supply Channels 1, 2, 3.

22

EN(1, 2, 3)

Circuit 2

Enable pin internal pull-down; Logic “1” selects the disabled state; Logic “0” selects

the enabled state. Channels 1, 2, 3

23

V+(1, 2, 3)

Circuit 4

Positive power supply for Channels 1, 2, 3.

24

IN+_1

Circuit 1

Amplifier 1 non-inverting input

Thermal Pad

Circuit 6

Thermal heat sink pad makes electrical contact the IC substrate and must be

connected to same ground potential as the ground pins.

IN+

V+

GND_PWR

EN

V+

21k

+

-

1.2V

V+_OUT(1, 2, 3)

GND_OUT(1, 2, 3)

OUT(1, 2, 3)

CIRCUIT 3

CIRCUIT 2

CIRCUIT 1

GND_PWR (1,2,3)

~1M

Ω

SUBSTRATE 1

THERMAL HEAT SINK PAD

~1M

Ω

SUBSTRATE 2

CIRCUIT 4

GND_IN-(1,2,3)

GND_PWR(1,2,3)

CIRCUIT 5

GND_IN-(4, 5, 6)

GND_PWR(4, 5, 6)

V+_OUT(4, 5, 6)

OUT(4, 5, 6)

GND_OUT(4, 5, 6)

V+(1, 2, 3)

V+(4,5,6)

CIRCUIT 6

GND(4, 5, 6)

1.5k

500

1.5k

500

GND_PWR

dv/dt

CLAMP

ISL55036