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EL5170ISZ-T13 Datasheet(PDF) 8 Page - Intersil Corporation |
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EL5170ISZ-T13 Datasheet(HTML) 8 Page - Intersil Corporation |
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8 / 14 page  8 FN7309.8 September 14, 2010 Simplified Schematic FIGURE 17. ENABLED RESPONSE FIGURE 18. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FIGURE 19. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE Typical Performance Curves (Continued) 486mW θJA = +206°C/W MSOP8 870mW θJA = +115°C/W QSOP24 1.2 1.0 0.8 0.6 0.4 0 0 255075 100 150 AMBIENT TEMPERATURE (°C) 125 85 JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0.2 625mW θJA = +160°C/W SO8 1.136W θJA = +88°C/W QSOP24 1.4 1.2 1.0 0.8 0.6 0.2 0 0 255075 100 150 AMBIENT TEMPERATURE (°C) 125 85 JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0.4 909mW 870mW θJA = +115°C/W MSOP8/10 θJA = +110°C/W SO8 REF R10 R9 RCD RCD OUT+ OUT- CC R6 R5 CC R4 R3 R7 R8 R2 R1 VB1 FBN FBP IN- IN+ VB2 VS+ VS- 200 Ω 200 Ω 400 Ω EL5170, EL5370 |
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