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ISL35111 Datasheet(PDF) 7 Page - Intersil Corporation |
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ISL35111 Datasheet(HTML) 7 Page - Intersil Corporation |
7 / 9 page 7 FN6975.1 January 27, 2010 Application Information Typical application schematic for ISL35111 is shown in Figure 8. PCB Layout Considerations Because of the high speed of the ISL35111 signals, careful PCB layout is critical to maximize performance. The following guidelines should be adhered to as closely as possible: • All high speed differential pair traces should have a characteristic impedance of 50Ω with respect to ground plane and 100Ω with respect to each other. • Avoid using vias for high speed traces as this will create discontinuity in the traces characteristic impedance. • Input and output traces need to have DC blocking capacitors (100nF). Capacitors should be placed as close to the chip as possible. • For each differential pair, the positive trace and the negative trace need to be of same length in order to avoid intra-pair skew. Serpentine technique may be used to match trace lengths. • Maintain a constant solid ground plane underneath the high-speed differential traces •Each VDD pin should be connected to 1.2V and also bypassed to ground through a 47nF and a 100pF capacitor in parallel. Minimize the trace length and avoid vias between the VDD pin and the bypass capacitors in order to maximize the power supply noise rejection. About Q:ACTIVE® Intersil has long realized that to enable the complex server clusters of next generation datacenters, it is critical to manage the signal integrity issues of electrical interconnects. To address this, Intersil has developed its groundbreaking Q:ACTIVE® product line. By integrating its analog ICs inside cabling interconnects, Intersil is able to achieve unsurpassed improvements in reach, power consumption, latency, and cable gauge size as well as increased airflow in tomorrow's datacenters. This new technology transforms passive cabling into intelligent "roadways" that yield lower operating expenses and capital expenditures for the expanding datacenter. Intersil Lane Extenders allow greater reach over existing cabling while reducing the need for thicker cables. This significantly reduces cable weight and clutter, increases airflow, and improves power consumption. FIGURE 8. TYPICAL APPLICATION REFERENCE SCHEMATIC FOR ISL35111 NOTES: 12. See “Adjustable De-Emphasis” on page 6 for information on how to connect the DE pins 13. See “Line Silence/Quiescent Mode” on page 6 for details on DT pin operation. 14. Although the filtering network is shown only for one VDD pin for simplicity, all the VDD pins need to be connected in this way. TDSBL DT DEA DEB 1.2V 1.2V 1.2V 47nF 47nF ISL35111 IN_P 2 IN_N 3 VDD 1 VDD 9 VDD 12 OUT_N 10 OUT_P 11 TDSBL 4 100nF 100nF 100nF 100nF 100pF 100pF 100nF 100nF 100nF 100nF OUTPUT SIGNAL INPUT SIGNAL LOS (output) ISL35111 |
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