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120220-0206 Datasheet(PDF) 3 Page - ITT Industries |
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120220-0206 Datasheet(HTML) 3 Page - ITT Industries |
3 / 4 page 3.48 ±0.15 1.00 ±0.10 0.55 0.40 Min At Max compression 0.80 2.05 Soldering area 2.35 5.50 ± 0.15 2.66 ± 0.30 Universal Contact Universal Contact is an independent SMT contact which provides an electrical connection between a device and a PCB. The contact is manufactured as a single piece stamped product, incorporating pre-load and anti-lift features. The Universal Contact has been designed to replace traditional interfaces where the contact is custom designed into the component. It can be used to connect a number of device components in any direction and configuration using the same interface. Features & Benefits of the Design • Range of heights available: - 1.3mm contact with the minimum pitch of 1.35mm - 1.8mm contact with the minimum pitch of 1.25mm - 2.5mm contact the minimum pitch is 1.35mm - 3.5 & 4.0mm minimum pitch is 1.45mm • Solderwell that prevents solder wicking up the contact • “Side wings” protect the active parts of the contact which prevent contact from overstressing and potential damage • Domed contact point allows good hertz stress and low contact resistance • The X-Y-Z movement allows robust connection between the contact and component assembly during shock and vibration • Compliant with WEEE and RoHS directives. 1.8mm 120220-0202 packaging: 6,800 per reel 3.5mm 120220-0204 packaging: 3,600 per reel 4mm 120220-0206 packaging: 3,200 per reel 2.5mm 120220-0161 packaging: 6,000 per reel 2 way - 2.5mm height, 1.5 pitch 120220-0162 1.3mm 120220-0210 packaging: 9,500 per reel 0.63 4.87 ± 0.15 0.74 Min At Max compression 1.19 1.02 ± 0.10 2.87 Soldering area 3.43 0.47 Min At Max compression 1.66 5.00 0.70 1.10 ± 0.10 2.80 Soldering area 3.25 5.00 ± 0.15 0.47 Min At Max compression 1.65 0.70 1.10 ± 0.10 Soldering area 3.00 2.80 3.41 ± 0.15 0.55 0.90 ± 0.10 0.40 Min At Max compression 0.84 1.80 Soldering area 2.35 © 2006 ITT Industries, Inc. Specifications and other data are based on information available at the time of printing, and are subject to change without notice. Materials & Finishes Base material Beryllium Copper Plating Selective Au in contact area 1 µm min over Au stripe, 0.05 - 0.1 µm over Ni 1.0 - 3.0 µm Electrical Contact resistance Max 20 m Ω Max current rating 2.0 amps nominal 3.0 amps peak Environmental Operating temperature -40˚C and +85˚C Humidity Operable in 90% relative humidity (temp + 40˚C) Solder systems Infrared and hot air reflow Vibration In accordance with IEC 68-2-36 Shock In accordance with IEC 68-2-27, 30 g Mechanical See selection table on the right for contact forces at specific mating heights Maximum mating cycle based on mating PCB plated with 0.05µ Au over 2.0µ m Ni = 3,000 cycles. (Wear resistance is subject to mating component surface finish and plating type, increased mating component plating spec = increased mating cycles.) Packaging Packaged in 12mm wide tape & reel packaging to EIA-481 standards Additional Advantages of using Universal Contacts • Qualification time reduction - same contact for many components • Allows standard interface across applications and platforms • Freedom to position at an angle - not fixed by mating component Applications Handset • Solderless component interconnect • I/O connector / Board to board interconnect • Battery contact / Antenna contact • Grounding contact / SIM contact Laptops & Computers • Memory Stick Home Electronic Devices / White Goods • Smoke detectors / Security alarm systems • Home appliances Automotive - Keyfob Medical - CT scan equipment Industrial - Circuit breaker for GPS beckon |
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Similar Description - 120220-0206 |
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