3000 datasheet(5/102 Pages) INTEL

Part #	3000

Description	Dual-Core Intel Xeon Processor

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Manufacturer	INTEL [Intel Corporation]

Direct Link	http://www.intel.com

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Dual-Core Intel® Xeon® Processor 3000 Series Datasheet

5

Figures

2-1

VCC Static and Transient Tolerance for Processors with 4 MB L2 Cache.......................... 22

2-2

VCC Static and Transient Tolerance for Processors with 2 MB L2 Cache.......................... 23

2-3

VCC Overshoot Example Waveform .......................................................................... 24

2-4

Differential Clock Waveform.................................................................................... 31

2-5

Differential Clock Crosspoint Specification................................................................. 32

2-6

Differential Measurements ...................................................................................... 32

2-7

Differential Clock Crosspoint Specification................................................................. 33

3-1

Processor Package Assembly Sketch ........................................................................ 35

3-2

Processor Package Drawing Sheet 1 of 3 .................................................................. 37

3-3

Processor Package Drawing Sheet 2 of 3 .................................................................. 38

3-4

Processor Package Drawing Sheet 3 of 3 .................................................................. 39

3-5

Processor Top-Side Markings Example for the Dual-Core Intel® Xeon®

Processor 3000 Series with 2MB L2 Cache with 1066 MHz FSB .................................... 41

3-6

Processor Top-Side Markings Example for the Dual-Core Intel® Xeon®

Processor 3000 Series with 4 MB L2 Cache with 1066 MHz FSB ................................... 42

3-7

Processor Top-Side Markings Example for the Dual-Core Intel® Xeon®

Processor 3000 Series with 4 MB L2 Cache with 1333 MHz FSB ................................... 42

3-8

Processor Land Coordinates and Quadrants (Top View)............................................... 43

4-1

land-out Diagram (Top View – Left Side) .................................................................. 46

4-2

land-out Diagram (Top View – Right Side) ................................................................ 47

5-1

Thermal Profile (Dual-Core Intel® Xeon® Processor 3000 Series

with 4 MB L2 Cache).............................................................................................. 77

5-2

Thermal Profile (Dual-Core Intel® Xeon® 3070/3060 Processor

with 4 MB L2 Cache).............................................................................................. 78

5-3

Thermal Profile (Dual-Core Intel® Xeon® Processor 3000 Series

with 2 MB L2 Cache).............................................................................................. 79

5-4

Case Temperature (TC) Measurement Location.......................................................... 80

5-5

Thermal Monitor 2 Frequency and Voltage Ordering ................................................... 82

5-6

Processor PECI Topology ........................................................................................ 86

7

Conceptual Fan Control on PECI-Based Platforms....................................................... 86

8

Conceptual Fan Control on Thermal Diode-Based Platforms ......................................... 87

6-1

Processor Low Power State Machine......................................................................... 90

7-1

Mechanical Representation of the Boxed Processor..................................................... 95

7-2

Space Requirements for the Boxed Processor (Side View) ........................................... 96

7-3

Space Requirements for the Boxed Processor (Top View) ............................................ 96

7-4

Space Requirements for the Boxed Processor (Overall View) ....................................... 97

7-5

Boxed Processor Fan Heatsink Power Cable Connector Description ............................... 98

7-6

Baseboard Power Header Placement Relative to Processor Socket ................................ 99

7-7

Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 1 View) .............. 100

7-8

Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View) .............. 100

7-9

Boxed Processor Fan Heatsink Set Points................................................................ 101

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