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Z530 Datasheet(PDF) 7 Page - Intel Corporation |
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Z530 Datasheet(HTML) 7 Page - Intel Corporation |
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7 / 73 page  Introduction Datasheet 7 1 Introduction The Intel® Atom™ processor Z5xx series is built on a new 45-nanometer Hi-k low power micro-architecture and 45 nm process technology—the first generation of low- power IA-32 micro-architecture specially designed for the new class of Mobile Internet Devices (MIDs). The Intel Atom processor Z5xx series supports the Intel® System Controller Hub (Intel® SCH), a single-chip component designed for low-power operation. 1.1 Abstract This document contains electrical, mechanical, and thermal specifications for Intel Atom processors Z560, Z550, Z540, Z530, Z520, Z515, Z510, and Z500. Note: In this document, Intel Atom processor Z5xx series refers to the Intel Atom processors Z560, Z550, Z540, Z530, Z520, Z515, Z510, and Z500. Note: In this document, the Intel Atom processor Z5xx series is referred to as “processor”. The Intel® System Controller Hub (Intel® SCH) is referred to as the “Intel® SCH”. 1.2 Major Features The following list provides some of the key features on this processor: • New single-core processor for mobile devices offering enhanced performance • On die, primary 32-kB instructions cache and 24-kB write-back data cache • 100-MHz and 133-MHz Source-Synchronous front side bus (FSB) 100 MHz: Intel Atom processor Z515, Z510, and Z500 133 MHz: Intel Atom processor Z560, Z550, Z540, Z530, and Z520. • Supports Hyper-Threading Technology 2-threads • On die 512-kB, 8-way L2 cache • Support for IA 32-bit architecture • Intel® Virtualization Technology (Intel® VT) • Intel® Streaming SIMD Extensions 2 and 3 (Intel® SSE2 and Intel® SSE3) and Supplemental Streaming SIMD Extensions 3 (SSSE3) support • Supports new CMOS FSB signaling for reduced power • Micro-FCBGA8 packaging technologies • Thermal management support using TM1 and TM2 • On die Digital Thermal Sensor (DTS) for thermal management support using Thermal Monitor (TM1 and TM2) • FSB Lane Reversal for flexible routing • Supports C0/C1(e)/C2(e)/C4(e) power states • Intel Deep Power Down Technology (C6) • L2 Dynamic Cache Sizing • Advanced power management features including Enhanced Intel SpeedStep® Technology |
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