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Z515 Datasheet(PDF) 3 Page - Intel Corporation

Part # Z515
Description  Intel Atom Processor
Download  73 Pages
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Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation

Z515 Datasheet(HTML) 3 Page - Intel Corporation

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Datasheet
3
Contents
1
Introduction...................................................................................................... 7
1.1
Abstract................................................................................................. 7
1.2
Major Features ....................................................................................... 7
1.3
Terminology........................................................................................... 9
1.4
References............................................................................................11
2
Low Power Features ..........................................................................................13
2.1
Clock Control and Low-Power States ........................................................13
2.1.1
Package/Core Low-Power State Descriptions ................................15
2.2
Dynamic Cache Sizing ............................................................................22
2.3
Enhanced Intel SpeedStep® Technology...................................................23
2.4
Enhanced Low-Power States....................................................................24
2.5
FSB Low Power Enhancements.................................................................25
2.5.1
CMOS Front Side Bus ................................................................25
2.6
Intel® Burst Performance Technology (Intel® BPT) ..................................26
3
Electrical Specifications .....................................................................................27
3.1
FSB, GTLREF, and CMREF........................................................................27
3.2
Power and Ground Pins...........................................................................27
3.3
Decoupling Guidelines ............................................................................28
3.3.1
VCC Decoupling .........................................................................28
3.3.2
FSB AGTL+ Decoupling..............................................................28
3.4
FSB Clock (BCLK[1:0]) and Processor Clocking ..........................................28
3.5
Voltage Identification and Power Sequencing.............................................28
3.6
Catastrophic Thermal Protection ..............................................................31
3.7
Reserved and Unused Pins ......................................................................31
3.8
FSB Frequency Select Signals (BSEL[2:0]) ................................................31
3.9
FSB Signal Groups .................................................................................31
3.10
CMOS Asynchronous Signals ...................................................................33
3.11
Maximum Ratings ..................................................................................33
3.12
Processor DC Specifications.....................................................................34
3.13
AGTL+ FSB Specifications .......................................................................45
4
Package Mechanical Specifications and Pin Information..........................................47
4.1
Package Mechanical Specifications ...........................................................47
4.1.1
Processor Package Weight .........................................................47
4.2
Processor Pinout Assignment...................................................................49
4.3
Signal Description..................................................................................56
5
Thermal Specifications and Design Considerations ................................................65
5.1
Thermal Specifications............................................................................68
5.1.1
Thermal Diode .........................................................................68
5.1.2
Intel® Thermal Monitor.............................................................70
5.1.3
Digital Thermal Sensor ..............................................................72


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