Figure 4.2. QFP-48 Landing Diagram
Table 4.2. QFP-48 Landing Diagram Dimensions
All dimensions shown are in millimeters (mm) unless otherwise noted.
This Land Pattern Design is based on the IPC-7351 guidelines.
Solder Mask Design
All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the
metal pad is to be 60
m minimum, all the way around the pad.
A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure
good solder paste release.
The stencil thickness should be 0.125mm (5 mils).
The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
A No-Clean, Type-3 solder paste is recommended.
Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body