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MAX19541EGK Datasheet(PDF) 9 Page - Maxim Integrated Products |
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MAX19541EGK Datasheet(HTML) 9 Page - Maxim Integrated Products |
9 / 23 page 12-Bit, 125Msps ADC with CMOS Outputs for Wideband Applications _______________________________________________________________________________________ 9 Pin Description (continued) PIN NAME FUNCTION 38 DB9 Port B CMOS Digital Output Bit 9 39 DB10 Port B CMOS Digital Output Bit 10 40 DB11 Port B CMOS Digital Output Bit 11 (MSB) 42 DCLKN Inverted CMOS Digital Clock Output. DCLKN provides a CMOS-compatible output level and can be used to synchronize external devices to the converter clock. When DEMUX is high, the frequency at DCLKN is half the sampling clock’s frequency. 43 DCLKP True CMOS Digital Clock Output. DCLKP provides a CMOS-compatible output level and can be used to synchronize external devices to the converter clock. When DEMUX is high, the frequency at DCLKP is half the sampling clock’s frequency. 46 ORB Port B CMOS Digital Output Overrange 47 DA0 Port A CMOS Digital Output Bit 0 (LSB) 48 DA1 Port A CMOS Digital Output Bit 1 49 DA2 Port A CMOS Digital Output Bit 2 50 DA3 Port A CMOS Digital Output Bit 3 51 DA4 Port A CMOS Digital Output Bit 4 52 DA5 Port A CMOS Digital Output Bit 5 53 DA6 Port A CMOS Digital Output Bit 6 54 DA7 Port A CMOS Digital Output Bit 7 55 DA8 Port A CMOS Digital Output Bit 8 56 DA9 Port A CMOS Digital Output Bit 9 57 DA10 Port A CMOS Digital Output Bit 10 58 DA11 Port A CMOS Digital Output Bit 11 (MSB) 59 ORA Port A CMOS Digital Output Overrange 67 ITL Interleaved/Parallel-Select Input. Drive ITL low for the demux parallel mode. Drive ITL high for the demux interleaved mode. 68 T/B Output-Format-Select Input. T/B is an LVCMOS-compatible input that controls the digital output format of the MAX19541. T/B has an internal pulldown resistor: T/B = 1: binary output format. T/B = 0: two’s-complement output format. EP AGND Exposed Paddle. Connect EP to the analog ground (AGND) for optimum performance. The exposed paddle is located on the backside of the chip. EP is internally connected to the die substrate. |
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