SIDC06D60F6

Edited by INFINEON Technologies, IMM PSD, L4344M, Edition 2.1, 09.03.2010

Fast switching diode

This chip is used for:

•

power modules and discrete

devices

Features:

•

600V Emitter Controlled technology 70 µm

chip

•

soft , fast switching

•

low reverse recovery charge

•

small temperature coefficient

Applications:

•

SMPS, resonant applications,

drives

A

C

Chip Type

Die Size

Package

SIDC06D60F6

600V

15A

sawn on foil

Mechanical Parameters

Raster size

2.45 x 2.45

Area total

6

Anode pad size

1.73 x 1.73

mm

2

Thickness

70

µm

Wafer size

150

mm

Max. possible chips per wafer

2520

Passivation frontside

Photoimide

Pad metal

3200 nm AlSiCu

Backside metal

Ni Ag –system

suitable for epoxy and soft solder die bonding

Die bond

Electrically conductive glue or solder

Wire bond

Al,

≤250µm

Reject ink dot size

∅ 0.65mm; max 1.2mm

Recommended storage environment

Store in original container, in dry nitrogen, in dark

environment, < 6 month at an ambient temperature of 23°C