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TIM5964-45SL Datasheet(PDF) 1 Page - Toshiba Semiconductor |
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TIM5964-45SL Datasheet(HTML) 1 Page - Toshiba Semiconductor |
1 / 4 page MICROWAVE POWER GaAs FET MICROWAVE SEMICONDUCTOR TIM5964-45SL TECHNICAL DATA FEATURES n LOW INTERMODULATION DISTORTION n HIGH GAIN IM3=-45 dBc at Pout= 35.5dBm G1dB=9.0dB at 5.9GHz to 6.4GHz Single Carrier Level n BROAD BAND INTERNALLY MATCHED FET n HIGH POWER n HERMETICALLY SEALED PACKAGE P1dB=46.5dBm at 5.9GHz to 6.4GHz RF PERFORMANCE SPECIFICATIONS ( Ta= 25 °C ) CHARACTERISTICS SYMBOL CONDITIONS UNIT MIN. TYP. MAX. Output Power at 1dB Gain Compression Point P1dB dBm 46.0 46.5 Power Gain at 1dB Gain Compression Point G1dB dB 8.0 9.0 Drain Current IDS A 9.6 10.8 Gain Flatness ∆G dB ±0.8 Power Added Efficiency ηadd VDS=10V f = 5.9 to 6.4GHz % 41 3rd Order Intermodulation Distortion IM3 Two-Tone Test Po=35.5dBm (Single Carrier Level) dBc -42 -45 Channel Temperature Rise ∆Tch (VDS X IDS + Pin – P1dB) X Rth(c-c) °C 100 Recommended Gate Resistance(Rg) : 28 Ω (Max.) ELECTRICAL CHARACTERISTICS ( Ta= 25 °C ) CHARACTERISTICS SYMBOL CONDITIONS UNIT MIN. TYP. MAX. Transconductance gm VDS= 3V IDS= 11.0A mS 8000 Pinch-off Voltage VGSoff VDS= 3V IDS= 170mA V -1.0 -2.5 -4.0 Saturated Drain Current IDSS VDS= 3V VGS= 0V A 24 Gate-Source Breakdown Voltage VGSO IGS= -500 µA V -5 Thermal Resistance Rth(c-c) Channel to Case °C/W 0.8 1.2 u The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA before proceeding with design of equipment incorporating this product. Rev. Jul. 2006 |
Similar Part No. - TIM5964-45SL_06 |
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Similar Description - TIM5964-45SL_06 |
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