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T492A156J025CC4251 Datasheet(PDF) 9 Page - Kemet Corporation |
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T492A156J025CC4251 Datasheet(HTML) 9 Page - Kemet Corporation |
9 / 17 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2006-1 • 10/11/2010 99 MIL-PRF (CWR Style) Established Reliability – T492 CWR11 Style Mil-PRF-55365/8 Time Tsmin 25° C to Peak tL tS 25 tP Tsmax TL TP Max Ramp Up Rate = 3° C/sec Max Ramp Down Rate = 6° C/sec Soldering Process KEMET’s families of surface mount tantalum capacitors are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET's recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020D standard for moisture sensitivety testing. The devices can safely withstand a maximum of three reflow passes at these conditions. Note that although the X/7343-43 case size can withstand wave soldering, the tall profile (4.3mm maximum) dictates care in wave process development. Time/Temperature Soldering Profile Profile Feature Sn-Pb Assembly Pb-Free Assembly Preheat/Soak Temperature Min (T Smin) 100°C 150°C Temperature Max (T Smax) 150°C 200°C Time (t s) from Tsmin to Tsmax) 60-120 sec 60-120 sec Ramp-up rate (T L to TP) 3°C/sec max 3°C/sec max Liquidous temperature (T L) 183°C 217°C Time above liquidous (t L) 60-150 sec 60-150 sec Peak Temperature (T P) 220°C* 235°C** 250°C* 260°C** Time within 5°C of max peak temperature (t P) 20 sec max 30 sec max Ramp-down rate (T P to TL) 6°C/sec max 6°C/sec max Time 25°C to peak temperature 6 minutes max 8 minutes max Note 1: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow. * Case Size D, E, P, Y and X **Case Size A, B, C, H, I, K, M, R, S, T, U, V, W and Z Construction MNO 2 /Ta2O5/Ta Silver Adhesive Carbon Silver Paint Washer Tantalum Wire Weld Leadframe (-Cathode) Leadframe (+Anode) |
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