RHFL4913XX25, RHFL4913XX33, RHFL4913XX50

Notes about Flat-16 package

Doc ID 10004 Rev 11

11/19

7

Notes about Flat-16 package

The bottom of package is metallized to allow user to directly solder the voltage regulator to

PCB, no heat sink needed, in order to optimize heat removal performance.

7.1

Radiation performances

The RHFL4913F has been tested against: 300krad TID ELDERS in accordance with Mil-

1019.6, bipolar section: post radiation parameters are within datasheet pre-rad limits.

Submitted to 200MeV Iodine ions of 60.4MeV/cm2/mg LET up to 1exp(+7) ions / cm2, no

SEL event has been detected.

7.2

Die information

RHFL4913 fixed is also available in die form. Space dice are electrically tested by

STMicroelectronics in such a way that, when mounted in proper thermal and electrical

substrate, they provide full compliance with equivalent packaged product.

- Max die dimensions: 2.794 mm by 3.861 mm or 110 mils by 152 mils

- Die thickness: 357 µm +/- 50 µm

- Pad size: 184 µm by 184 µm

- Metallization: Aluminum 4% silicon alloy

- Die backside: Bare silicon

- Die backside potential: Ground

(**) Die adjust pad is available in the die lay-out but is not electrically connected to the IC. It shall be left

unconnected during hybrid bonding.

Figure 5.

Die size