AP21X2MPG-13 datasheet(5/17 Pages) DIODES

Part #	AP21X2MPG-13

Description	1.5A DUAL CHANNEL CURRENT-LIMITED POWER

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Manufacturer	DIODES [Diodes Incorporated]

Direct Link	http://www.diodes.com

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5 / 17 page

AP2182/AP2192

1.5A DUAL CHANNEL CURRENT-LIMITED POWER

SWITCH

AP2182/AP2192 Rev. 6

5 of 17

JULY 2010

www.diodes.com

Electrical Characteristics

(TA = 25

oC, V

IN = +5.0V, unless otherwise stated)

Symbol

Parameter

Test Conditions

Min

Typ.

Max

Unit

VUVLO

Input UVLO

Rload=1kΩ

1.6

1.9

2.5

V

ISHDN

Input Shutdown Current

Disabled, IOUT= 0

0.5

1

μA

IQ

Input Quiescent Current, Dual

Enabled, IOUT= 0

100

160

μA

ILEAK

Input Leakage Current

Disabled, OUT grounded

1

μA

IREV

Reverse Leakage Current

Disabled, VIN = 0V, VOUT = 5V, IREV at VIN

1

μA

RDS(ON)

Switch on-resistance

VIN = 5V,

IOUT= 0.5A

MSOP-8L-EP, -40

oC≤ T

A ≤85

oC

115

150

m

Ω

SOP-8L, -40

oC≤ T

A ≤ 85

oC

120

160

m

Ω

VIN = 3.3V,

IOUT= 0.5A

-40

oC≤ T

A ≤85

oC

140

180

m

Ω

ISHORT

Short-circuit current limit

Enabled into short circuit, CL=68μF

2.0

A

ILIMIT

Over-Load Current Limit

VIN = 5V,

VOUT = 4.5V,

CL=68μF

-40

oC≤ T

A ≤85

oC

1.6

2.1

2.6

A

ITrig

Current limiting trigger threshold

VIN = VEN, Output Current Slew rate (<100A/s),

CL=68μF

3.0

A

VIL

EN Input Logic Low Voltage

VIN = 2.7V to 5.5V

0.8

V

VIH

EN Input Logic High Voltage

VIN = 2.7V to 5.5V

2

V

ISINK

EN Input leakage

VEN = 5V

1

μA

TD(ON)

Output turn-on delay time

CL=1μF, Rload=10Ω

0.05

ms

TR

Output turn-on rise time

CL=1μF, Rload=10Ω

0.6

1.5

ms

TD(OFF)

Output turn-off delay time

CL=1μF, Rload=10Ω

0.01

ms

TF

Output turn-off fall time

CL=1μF, Rload=10Ω

0.05

0.1

ms

RFLG

FLG output FET on-resistance

IFLG =10mA

30

50

Ω

TBlank

FLG blanking time

CIN=10μF, CL=68μF

4

7

15

ms

TSHDN

Thermal shutdown threshold

Enabled, Rload=1kΩ

140

°C

THYS

Thermal shutdown hysteresis

25

°C

θJA

Thermal Resistance

Junction-to-Ambient

SOP-8L (Note 4)

110

oC/W

MSOP-8L-EP (Note 5)

60

oC/W

Notes:

4. Test condition for SOP-8L: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad layout.

5. Test condition for MSOP-8L-EP: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3

vias to bottom layer ground plane.

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