AP2280-2FMG-7 datasheet(4/12 Pages) DIODES

Part #	AP2280-2FMG-7

Description	Single Channel Slew Rate Controlled Load Switch

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Manufacturer	DIODES [Diodes Incorporated]

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AP2280

Single Channel Slew Rate Controlled Load Switch

AP2280 Rev. 6

4 of 12

FEBRUARY 2009

www.diodes.com

(TA = 25

oC, V

IN = VEN = 5.0V, unless otherwise stated)

Symbol

Parameters

Test Conditions

Min

Typ.

Max

Unit

IQ

Input Quiescent Current

VEN = VIN, IOUT= 0

⎯

0.004

1

μA

ISHDN

Input Shutdown Current

VEN = 0V, OUT open

⎯

0.004

1

μA

ILEAK

Input Leakage Current

VEN = 0V, OUT grounded

⎯

0.01

1

μA

RDS(ON)

Switch on-resistance

VIN = 5.0V

80

105

m

Ω

VIN = 3.3V

92

120

m

Ω

VIN = 1.8V

150

200

m

Ω

VIN = 1.5V

200

250

m

Ω

VIL

EN Input Logic Low Voltage

VIN = 1.5V to 6V

0.4

V

VIH

EN Input Logic High Voltage

1.5V ≤ VIN ≤ 2.7V

1.4

V

2.7V < VIN < 5.25V

1.6

V

VIN ≥ 5.25V

1.7

V

ISINK

EN Input leakage

VEN = 5V

⎯

1

μA

TD(ON)

Output turn-on delay time

Rload=10Ω

1

μS

TON

Output turn-on rise time

AP2280-1, Rload=10Ω

100

150

μS

AP2280-2, Rload=10Ω

1000 1500

μS

TD(OFF)

Output turn-off delay time

Rload=10Ω

0.4

1

μS

RDISCH

Discharge FET on-resistance

VEN = GND

20

40

Ω

θ

JA

Thermal Resistance Junction-to-Ambient

SOT25 (Note 5)

160

oC/W

DFN2018-6 (Note 6)

93

θ

JC

Thermal Resistance Junction-to-case

SOT25 (Note 5)

38

oC/W

DFN2018-6 (Note 6)

41

Notes:

5. Test condition for SOT25: Device mounted on FR-4 substrate PC board, with minimum recommended pad layout.

6. Test condition for DFN2018-6: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to

bottom layer 1.0"x1.4" ground plane.

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