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TPS8267XEVM Datasheet(PDF) 1 Page - Texas Instruments

Part # TPS8267XEVM
Description  The TPS82671 and TPS82675 devices are series of high-frequency, synchronous, step-down dc-dc converters optimized for battery-powered portable applications
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
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User's Guide
SLVU383A – October 2010 – Revised November 2010
TPS8267xEVM
This user’s guide describes the characteristics, operation, and use of the TPS8267xEVM-646 evaluation
module (EVM). The TPS8267xEVM-646 is a fully assembled and tested platform for evaluating the
performance of the TPS82671 and TPS82675 high-frequency, synchronous, step-down dc-dc converters
optimized for battery-powered portable applications. This document includes schematic diagrams, a
printed circuit board (PCB) layout, bill of materials, and test data. Throughout this document, the
abbreviations EVM and TPS8267xEVM and the term evaluation module are synonymous with the
TPS8267xEVM-646 unless otherwise noted.
Contents
1
Introduction
.................................................................................................................. 2
1.1
Features
............................................................................................................. 2
1.2
Applications
......................................................................................................... 2
1.3
EVM Ordering Options
............................................................................................ 2
2
TPS8267xEVM Schematic
................................................................................................. 3
3
Connector and Test Point Descriptions
.................................................................................. 3
3.1
Input / Output Connectors: TPS8267xEVM
.................................................................... 3
3.2
Jumpers and Switches
............................................................................................ 4
4
Test Configuration
.......................................................................................................... 5
4.1
Hardware Setup
.................................................................................................... 5
4.2
Procedure
........................................................................................................... 5
5
TPS8267xEVM Test Data
................................................................................................. 6
5.1
Thermal Performance
............................................................................................. 6
6
TPS8267xEVM Assembly Drawings and Layout
....................................................................... 8
7
Bill of Materials
............................................................................................................. 11
8
Marking Information
....................................................................................................... 11
List of Figures
1
TPS8267xEVM Schematic
................................................................................................. 3
2
Hardware Board Connection
.............................................................................................. 5
3
Top Side Thermal Measurement
.......................................................................................... 6
4
Bottom Side Thermal Measurement
...................................................................................... 7
5
TPS8267xEVM Component Placement (Top View)
.................................................................... 8
6
TPS8267xEVM Top-Side Copper (Top View)
........................................................................... 9
7
TPS8267xEVM Bottom-Side Copper (Bottom View)
................................................................. 10
Bluetooth is a registered trademark of Bluetooth SIG.
All other trademarks are the property of their respective owners.
1
SLVU383A – October 2010 – Revised November 2010
TPS8267xEVM
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Copyright © 2010, Texas Instruments Incorporated


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