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TPS61199 Datasheet(PDF) 2 Page - Texas Instruments |
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TPS61199 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 25 page TPS61199 SLVSAN3 – DECEMBER 2010 www.ti.com Table 1. PACKAGE INFORMATION(1) PACKAGE PART NUMBER(2) SOP – 20 TPS61199NS HTSSOP – 20 TPS61199PWP (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document; or, see the TI Web site at www.ti.com. (2) The SOP and HTSSOP package are available in tape and reel. Add R suffix (TPS61199PWPR / TPS61199NSR) to order quantities of 2000 parts per reel. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT MIN MAX Pin VIN(2) –0.3 30 Pin IFB1 to IFB8(2) –0.3 30 Voltage Range Pin EN and PWM(2) –0.3 20 V Pin ISET, ISNS and OVP(2) –0.3 3.3 All other pins(2) –0.3 7 HBM ESD rating 2 KV Continuous Power Dissipation See Thermal Information Table Operating Junction Temperature Range –40 +150 °C Storage Temperature Range –65 +150 (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal RECOMMENDED OPERATING CONDITIONS (1) MIN NOM MAX UNIT L1 Inductor 10 22 47 µH C1 Input capacitor 10 µF C2 Output capacitor 10 33 100 µF fPWM PWM dimming frequency 0.1 22 KHz tPWM Rising/falling edge of PWM signal 1 µsec fBOOST Boost regulator switching frequency 300 800 kHz TA Operating ambient temperature –40 85 °C (1) Customers need to verify the component values in their application if the values are different from the recommended values. THERMAL INFORMATION TPS61199 TPS61199 THERMAL METRIC(1) NS PWP UNITS 20 PINS 20 PINS qJA Junction-to-ambient thermal resistance 69.4 46.9 qJCtop Junction-to-case (top) thermal resistance 36.4 48.2 qJB Junction-to-board thermal resistance 37.3 22.1 °C/W yJT Junction-to-top characterization parameter 11.0 3.4 yJB Junction-to-board characterization parameter 36.8 13.3 qJCbot Junction-to-case (bottom) thermal resistance n/a 2.3 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS61199 |
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