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AD8222BCPZ-R7 Datasheet(PDF) 6 Page - Analog Devices |
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AD8222BCPZ-R7 Datasheet(HTML) 6 Page - Analog Devices |
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6 / 24 page  AD8222 Rev. A | Page 6 of 24 ABSOLUTE MAXIMUM RATINGS Table 5. Parameter Rating Supply Voltage ±18 V Output Short-Circuit Current Duration Indefinite Input Voltage (Common Mode) ±VS Differential Input Voltage ±VS Storage Temperature Range −65°C to +130°C Operational Temperature Range −40°C to +125°C Package Glass Transition Temperature (TG) 130°C ESD Human Body Model 1 kV Charge Device Model 1 kV Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions may affect device reliability. THERMAL RESISTANCE Table 6. Package θJA Unit CP-16-19: LFCSP Without Thermal Pad 86 °C/W CP-16-13: LFCSP with Thermal Pad 48 °C/W The θJA values in Table 6 assume a 4-layer JEDEC standard board. For the LFCSP with thermal pad, it is assumed that the thermal pad is soldered to a landing on the PCB board, with the landing thermally connected to a heat dissipating power plane. θJC at the exposed pad is 4.4°C/W. Maximum Power Dissipation The maximum safe power dissipation for the AD8222 is limited by the associated rise in junction temperature (TJ) on the die. At approximately 130C, which is the glass transition temperature, the plastic changes its properties. Even temporarily exceeding this temperature limit may change the stresses that the package exerts on the die, permanently shifting the parametric performance of the amplifiers. Exceeding a temperature of 130°C for an extended period can result in a loss of functionality. ESD CAUTION |
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