PESD5V0S1BSF

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© NXP B.V. 2011. All rights reserved.

Product data sheet

Rev. 2 — 18 February 2011

9 of 13

NXP Semiconductors

PESD5V0S1BSF

Bidirectional low capacitance ESD protection diode

9.

Packing information

[1]

For further information and the availability of packing methods, see Section 13.

10. Soldering

Based on results of board mount testing, NXP Semiconductors requires the following

soldering guidelines:

1. Soldering footprint as indicated in Figure 12: solder paste has to cover the whole

solder land area.

2. Non-solder mask defined (copper-defined) solder lands.

3. Minimum stencil thickness of 100

m.

4. Paste type 4 or smaller sphere size.

5. Pick and placement accuracy of

50 m.

Table 9.

Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.[1]

Type number

Package

Description

Packing quantity

9000

PESD5V0S1BSF

SOD962

2 mm pitch, 8 mm tape and reel

-315

Reflow soldering is the required soldering method.

Fig 12. Required reflow soldering footprint PESD5V0S1BSF (SOD962)

Footprint information for reflow soldering of leadless ultra small package; 2 terminals

SOD962

sod962_fr

solder land

solder resist

solder land plus solder paste

solder paste deposit

Dimensions in mm

R0.025 (8

×)

0.12

(2

×)

0.2

(2

×)

0.22

(2

×)

0.4

0.85

0.4