Electronic Components Datasheet Search |
|
CP304 Datasheet(PDF) 1 Page - Central Semiconductor Corp |
|
CP304 Datasheet(HTML) 1 Page - Central Semiconductor Corp |
1 / 2 page GEOMETRY PROCESS DETAILS PRINCIPAL DEVICE TYPES MPSA05 MPSA06 GROSS DIE PER 4 INCH WAFER 22,400 PROCESS CP304 Small Signal Transistor NPN - High Current Transistor Chip Process EPITAXIAL PLANAR Die Size 22 x 22 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 5.7 x 3.9 MILS Emitter Bonding Pad Area 5.3 x 3.9 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 18,000Å www.centra lsemi.com R4 (22-March 2010) |
Similar Part No. - CP304 |
|
Similar Description - CP304 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |