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CP704 Datasheet(PDF) 1 Page - Central Semiconductor Corp |
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CP704 Datasheet(HTML) 1 Page - Central Semiconductor Corp |
1 / 2 page PROCESS CP704 Small Signal Transistors PNP - High Current Transistor Chip 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com PRINCIPAL DEVICE TYPES MPSA55 MPSA56 GEOMETRY PROCESS DETAILS R2 (23 -August 2006) BACKSIDE COLLECTOR Process EPITAXIAL PLANAR Die Size 22 x 22 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 3.7 X 3.7 MILS Emitter Bonding Pad Area 4.2 X 4.2 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 18,000Å GROSS DIE PER 4 INCH WAFER 23,450 |
Similar Part No. - CP704_06 |
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Similar Description - CP704_06 |
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