Notes on Handling

1. ESD prevention

This CCD image sensor is easily damaged by ESD (electrostatic discharge). The following ESD prevention measures

must be taken when handling this device.

• All personnel and all equipment must be grounded when handling this CCD device. For safety, personnel should be

grounded through a resistor of about 1 M

Ω. (We recommend using wrist straps.)

• This device should be handled with either bare hands or hands wearing antistatic gloves. Personnel should wear

antistatic clothing. Conductive shoes must be worn.

• Spread conductive mats on floors and benches in the work areas to prevent static charges from accumulating.

• We recommend using ionized air blowers to minimize static charges in areas where CCD sensors are handled.

• Antistatic boxes must be used for transporting substrate mounting materials.

• Packing materials, boxes, and other items made from plastics, such as styrofoam, that easily accumulate static

charges must not be placed on tables where CCD sensors are handled or in the vicinity of CCD handling operations.

• Tools, including testers, conveyors, and soldering irons, used in operations on CCD sensors must be grounded.

Furthermore, the quality of that grounding must be tested periodically.

• Do not handle this IC in the vicinity of TV monitors or other devices that generate high static charges. If

unavoidable, apply antistatic measures, such as covering the TV monitor screen with an antistatic filter.

• Since static charges accumulate more easily at a low relative humidity, the work environment must be maintained at

a relative humidity of 50% or higher.

2. Soldering

• The package temperature must not exceed 80°C.

• In addition to ESD, CCD sensors are easily damaged by thermal stress. When mounting on a printed circuit board,

the soldering iron temperature must never exceed 300°C, and the soldering time for each pin should be about 2

seconds.

• Only use soldering irons that include a temperature controller that holds the soldering tip at a fixed temperature.

• Be especially careful to avoid heating the device to over 80°C when repairing solder joints by hand and when

removing CCDs sensors from printed circuit boards.

3. Debris and contamination

• Handle CCD sensors in a clean location only.

• Do not touch the package surface with bare hands. Also, do not allow the package surface to come in contact with

any objects. If any foreign matter gets onto the package surface, remove it with an air blower. (We recommend

using an ionized air blower if possible.)

• Remove oil or grease contamination from the CCD package surface with a cotton swab dipped in ethyl alcohol. Be

careful not to damage the package surface.

• To prevent foreign matter and contamination from occurring, use dedicated cases to hold the CCD sensors, and also

equalize temperatures gradually when moving CCD sensors between rooms with radical temperature differences to

prevent condensation.

4. Storage

• Do not leave CCDs exposed to strong light, such as direct sunlight, for extended periods.

• Since high temperatures and high humidity can degrade device characteristics, avoid storing or using these devices

in such environments. The temperature and humidity of locations used to store samples must always be within

normal ranges (5 to 35°C and 45 to 75% RH).

• Since CCD sensors are precision optical instruments, be extremely careful not to apply mechanical shocks to these

devices.

• Avoid locations with corrosive atmospheres or high dust levels.

• Avoid locations subject to rapid temperature changes.

• Do not stack heavy objects on top of containers holding CCD sensors during storage.

• Containers used to hold sample must be made from materials with good antistatic properties.

• Be extremely careful not to apply mechanical shocks to these devices, since that could lead to bent pins and reduced

reliability during mounting.

No. 5783-10/11

LC9997M