11

References

[1] K. Azar, S.S. Pan, J. Parry, H. Rosten, “Effect of Circuit Board Parameters on Thermal Performance of Electronic

Components in Natural Convection Cooling,” IEEE 10th annual Semi-Therm Conference, Feb. 1994.

[2] A. Bar-Cohen, & A.D. Krauss, “Advances in Thermal Modeling of Electronic Components & Systems,” Vol 1,

Hemisphere Publishing, Washington, D.C., 1988.

[3] R.T. Bilson, M.R. Hepher, J.P. McCarthy, “The Impact of Surface Mounted Chip Carrier Packaging on Thermal

Management in Hybrid Microcircuit,” Thermal Management Concepts in Microelectronics Packaging, InterFairchild

Society for Hybrid Microelectronics, 1984.

[4] R.A. Brewster, R.A. Sherif, “Thermal Analysis of A Substrate with Power Dissipation in the Vias,” IEEE 8th Annual

Semi-Therm Conf., Austin, Tx , Feb. 1992.

[5] D. Edwards, “Thermal Enhancement of IC Packages, “ IEEE 10th Annual Semi-Therm Conf., San Jose, Ca, Feb.

1994.

[6] S.S. Furkay, “Convective Heat Transfer in Electronic Equipment: An Overview,” Thermal Management Concepts,

1984.

[7] C. Harper, Electronic Packaging & Interconnection Handbook, McGraw-Hill, NY, 1991, Ch. 2.

[8] Y.M. Kasem, R.K. Williams, “Thermal Design Principles and Characterization of Miniaturized Surface-Mount Pack-

ages for Power Electronics,” IEEE 10th annual Semi-Therm Conf., San Jose, Ca, Feb. 1994.

[9] V. Manno, N.R. Kurita, K. Azar, “Experimental Characterization of Board Conduction Effect,” IEEE 9th Annual Semi-

Therm Conf., 1993.

[10] J.W. Sofia, “Analysis of Thermal Transient Data with Synthesized Dynamic Models for Semiconductor Devices,”

IEEE 10th Annual Semi-Therm Conf., San Jose, Ca, Feb. 1994.

[11]G.R. Wagner, “Circuit Board Material/Construction and its Effect on Thermal Management,” Thermal Management

Concepts, 1984.

[12] M. Wills, “Thermal Analysis of Air-Cooled Cbs,” Electron Prod., pp. 11-18, May 1983.

[13] Motorola Application Note AN-569.