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FAN3226T Datasheet(PDF) 2 Page - Fairchild Semiconductor |
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FAN3226T Datasheet(HTML) 2 Page - Fairchild Semiconductor |
2 / 22 page © 2007 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN3100 • Rev. 1.0.3 2 Ordering Information Part Number Input Threshold Package Packing Method Quantity / Reel FAN3100CMPX CMOS 6-Lead 2x2mm MLP Tape & Reel 3000 FAN3100CSX CMOS 5-Pin SOT23 Tape & Reel 3000 FAN3100TMPX TTL 6-Lead 2x2mm MLP Tape & Reel 3000 FAN3100TSX TTL 5-Pin SOT23 Tape & Reel 3000 Package Outlines Figure 3. 2x2mm 6-Lead MLP (Top View) Figure 4. SOT23-5 (Top View) Thermal Characteristics(1) Package JL (2) JT (3) JA (4) JB (5) JT (6) Units 6-Lead 2x2mm Molded Leadless Package (MLP) 2.7 133 58 2.8 42 °C/W SOT23-5 56 99 157 51 5 °C/W Notes: 1. Estimates derived from thermal simulation; actual values depend on the application. 2. Theta_JL ( JL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any thermal pad) that are typically soldered to a PCB. 3. Theta_JT ( JT): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is held at a uniform temperature by a top-side heatsink. 4. Theta_JA (ΘJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow. The value given is for natural convection with no heatsink using a 2SP2 board, as specified in JEDEC standards JESD51-2, JESD51-5, and JESD51-7, as appropriate. 5. Psi_JB ( JB): Thermal characterization parameter providing correlation between semiconductor junction temperature and an application circuit board reference point for the thermal environment defined in Note 4. For the MLP-6 package, the board reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the SOT23-5 package, the board reference is defined as the PCB copper adjacent to pin 2. 6. Psi_JT ( JT): Thermal characterization parameter providing correlation between the semiconductor junction temperature and the center of the top of the package for the thermal environment defined in Note 4. |
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