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FAN5358S713X Datasheet(PDF) 3 Page - Fairchild Semiconductor |
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FAN5358S713X Datasheet(HTML) 3 Page - Fairchild Semiconductor |
3 / 13 page © 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5358 • Rev. 1.0.2 3 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Units VIN Input Voltage with Respect to GND -0.3 6.0 V Voltage on Any Other Pin with Respect to GND -0.3 VIN +0.3V (2) V TJ Junction Temperature -40 +150 °C TSTG Storage Temperature -65 +150 °C TL Lead Temperature (Soldering 10 Seconds) +260 °C ESD Electrostatic Discharge Protection Level Human Body Model, JESD22-A114 2 kV Charged Device Model, JESD22-C101 1 Note: 2. Lesser of 6.0V or VIN + 0.3V Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Typ. Max. Units VCC Supply Voltage Range 2.7 5.5 V IOUT Output Current 0 500 mA L Inductor 2.2 µH CIN Input Capacitor 2.2 µF COUT Output Capacitor (3) 4.7 µF TA Operating Ambient Temperature –40 +85 °C TJ Operating Junction Temperature –40 +125 °C Thermal Properties Symbol Parameter Min. Typ. Max. Units ΘJA Junction-to-Ambient Thermal Resistance (4) 285 °C/W Notes: 3. Refer to Operation Description section for guidance on maximum COUT capabilities. 4. Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer 2s2p boards in accordance to JESD51- JEDEC standard. Special attention must be paid not to exceed junction temperature TJ(max) at a given ambient temperate TA. |
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