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TLWF1109T11 Datasheet(PDF) 7 Page - Toshiba Semiconductor |
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TLWF1109T11 Datasheet(HTML) 7 Page - Toshiba Semiconductor |
7 / 10 page TLWF1109(T11) 2010-06-03 7 Cleaning When cleaning is required after soldering, Toshiba recommends the following cleaning solvents. It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the recommended conditions). In selecting the one for your actual usage, please perform sufficient review on washing condition, using condition and etc. ASAHI CLEAN AK-225AES : (made by ASAHI GLASS) KAO CLEAN THROUGH 750H : (made by KAO) PINE ALPHA ST-100S : (made by ARAKAWA CHEMICAL) Precautions when Mounting Do not apply force to the plastic part of the LED under high-temperature conditions. To avoid damaging the LED plastic, do not apply friction using a hard material. When installing the PCB in a product, ensure that the device does not come into contact with other cmponents. For this product, silicone is used as the encapsulated material. Therefore the top surface of this product is soft. Please do not stress on the encapsulated part of LEDs to avoid affecting the reliability of the product. When using the mounting devices, please use the picking up nozzle that does not affect the silicone resin. Tape Specifications 1. Product number format The type of package used for shipment is denoted by a symbol suffix after the product number. The method of classification is as below. (this method, however does not apply to products whose electrical characteristics differ from standard Toshiba specifications) (1) Tape Type: T11 (4-mm pitch) (2) Example 2. Tape dimensions Unit: mm Symbol Dimension Tolerance Symbol Dimension Tolerance D 1.5 +0.1/−0 P2 2.0 ±0.05 E 1.75 ±0.1 W 8.0 ±0.3 P0 4.0 ±0.1 P 4.0 ±0.1 t 0.3 ±0.05 A0 2.9 ±0.1 F 3.5 ±0.05 B0 3.7 ±0.1 D1 1.5 ±0.1 K0 2.3 ±0.1 TLWF1109 (T11) Tape type Toshiba product No. A0 P D1 F E W Polarity t K0 B0 D P2 P0 |
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