Low-Cost, Small, 4.5V to 28V Wide Operating

Range, DC-DC Synchronous Buck Controller

2

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Note 1: Dissipation wattage values are based on still air with no heatsink. Actual maximum power dissipation is a function of heat

extraction technique and may be substantially higher. Package thermal resistances were obtained using the method

described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal consid-

IN to GND ...............................................................-0.3V to +30V

BST to GND ............................................................-0.3V to +36V

LX to GND .................................................................-1V to +30V

EN to GND................................................................-0.3V to +6V

PGOOD to GND .....................................................-0.3V to +30V

BST to LX..................................................................-0.3V to +6V

DRV to GND .............................................................-0.3V to +6V

DRV Input Current.............................................................600mA

PGOOD Sink Current ............................................................5mA

14-Pin TDFN-EP, Multilayer Board

(derate 24.4mW/°C above +70°C) ..............................1951mW

Operating Temperature Range

MAX15026B/CETD+, MAX15026BETD/V+.......-40°C to +85°C

MAX15026B/CATD+ .......................................-40°C to +125°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-60°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

GENERAL

4.5

28

Input Voltage Range

4.5

5.5

V

Quiescent Supply Current

1.75

2.75

mA

Shutdown Supply Current

EN = GND

290

500

µA

Enable to Output Delay

480

µs

375

µs

Output Voltage

5.0

5.25

5.5

V

0.28

V

100

200

300

mA

3.8

4.0

4.2

V

Hysteresis

400

mV

ERROR AMPLIFIER (FB, COMP)

FB Input Voltage Set-Point

585

591

597

mV

FB Input Bias Current

-250

+250

nA

FB to COMP Transconductance

600

1200

1800

µS

Amplifier Open-Loop Gain

80

dB

Amplifier Unity-Gain Bandwidth

Capacitor from COMP to GND = 50pF

4

MHz

160

mV

COMP Source/Sink Current

50

80

110

µA