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ADP5033ACBZ-1-R7 Datasheet(PDF) 6 Page - Analog Devices |
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ADP5033ACBZ-1-R7 Datasheet(HTML) 6 Page - Analog Devices |
6 / 28 page ADP5033 Rev. 0 | Page 6 of 28 ABSOLUTE MAXIMUM RATINGS Table 5. Parameter Rating VIN1, VIN2, VIN3, VIN4, VOUT1, VOUT2, VOUT3, VOUT4, ENA, MODE, ENB to Ground –0.3 V to +6 V Storage Temperature Range –65°C to +150°C Operating Junction Temperature Range –40°C to +125°C Soldering Conditions JEDEC J-STD-020 ESD Human Body Model ±1500 V ESD Charged Device Model ±500 V ESD Machine Model ±100 V Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. For detailed information on power dissipation, see the Power Dissipation and Thermal Considerations section. THERMAL RESISTANCE θJA and ΨJB are specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 6. Thermal Resistance Package Type θJA ΨJB Unit 16-Ball, 0.5 mm Pitch WLCSP 57 14 °C/W ESD CAUTION |
Similar Part No. - ADP5033ACBZ-1-R7 |
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Similar Description - ADP5033ACBZ-1-R7 |
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