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TLE42994EV33 Datasheet(PDF) 8 Page - Infineon Technologies AG

Part No. TLE42994EV33
Description  Low Dropout Fixed Voltage Regulator
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Manufacturer  INFINEON [Infineon Technologies AG]
Direct Link  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

TLE42994EV33 Datasheet(HTML) 8 Page - Infineon Technologies AG

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Data Sheet
8
Rev. 1.01, 2010-10-14
TLE42994V33
General Product Characteristics
4.2
Functional Range
Note: Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics table.
4.3
Thermal Resistance
Pos.
Parameter
Symbol
Limit Values
Unit
Conditions
Min.
Max.
4.2.1
Input Voltage
V
I
4.4
45
V
4.2.2
Output Capacitor’s Requirements
for Stability
C
Q
22
µF
1)
1) the minimum output capacitance requirement is applicable for a worst case capacitance tolerance of 30%
ESR(C
Q)
–3
Ω
2)
2) relevant ESR value at
f =10kHz
4.2.3
Junction Temperature
T
j
-40
150
°C–
Pos.
Parameter
Symbol
Limit Value
Unit
Conditions
Min.
Typ.
Max.
TLE42994GMV33 (PG-DSO-14)
4.3.1
Junction to Soldering Point1)
1) not subject to production test, specified by design
R
thJSP
30
K/W
measured to pin 5
4.3.2
Junction to Ambient1)
R
thJA
–63
K/W
2)
2) Specified
R
thJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm³ board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.
4.3.3
112
K/W
Footprint only3)
3) Specified
R
thJA value is according to JEDEC JESD 51-3 at natural convection on FR4 1s0p board; The Product
(Chip+Package) was simulated on a 76.2
× 114.3 × 1.5 mm3 board with 1 copper layer (1 x 70µm Cu).
4.3.4
73
K/W
300mm2 heatsink area on
PCB3)
4.3.5
65
K/W
600mm2 heatsink area on
PCB3)
TLE42994EV33 (PG-SSOP-14 Exposed Pad)
4.3.6
Junction to Soldering Point1)
R
thJSP
10
K/W
measured to all GND pins
4.3.7
Junction to Ambient1)
R
thJA
–47
K/W
2)
4.3.8
140
K/W
Footprint only3)
4.3.9
63
K/W
300mm2 heatsink area on
PCB3)
4.3.10
53
K/W
600mm2 heatsink area on
PCB3)


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