Varistor Products

©2010 Littelfuse, Inc.

Revision: June 28, 2010

MHS Varistor Series

Surface Mount Multilayer Varistors (MLVs) > MHS Series

Specifications are subject to change without notice.

Please refer to www.littelfuse.com/series/MHS.html for current information.

Product Dimensions (mm)

Note: Avoid metal runs in this area, parts are

not recommended for use in applications using

Silver (Ag) epoxy paste.

D

E

W

L

Dimension

0402 Size

0603 Size

IN

MM

IN

MM

A

0.067

1.700

0.100

2.540

B

0.020

0.510

0.030

0.760

C

0.024

0.610

0.035

0.890

D (max.)

0.024

0.600

0.040

1.000

E

0.10 +/- 0.006

0.25 +/- 0.15

0.015 +/- 0.008

0.4 +/- 0.2

L

0.039 +/- 0.004

1.00 +/- 0.10

0.063 +/- 0.006

1.6 +/- 0.15

W

0.020 +/- 0.004

0.50 +/- 0.10

0.032 +/- 0.006

0.8 +/- 0.15

PAD LAYOUT DEMENSIONS

CHIP LAYOUT DIMENSIONS

5.0

6.0

7.0

MAXIMUM TEMPERATURE 260˚C

20 - 40 SECONDS WITHIN 5˚C

PREHEAT ZONE

RAMP RATE

<3˚C/s

60 - 150 SEC

> 217˚C

Lead–free (Pb-free) Soldering Recommendations

Littelfuse offers the Nickel Barrier Termination finish for the

optimum Lead–free solder performance.

The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA

flux, but there is a wide selection of pastes and fluxes

available with which the Nickel Barrier parts should be

compatible.

The reflow profile must be constrained by the maximums

in the Lead–free Reflow Profile. For Lead–free wave

soldering, the Wave Solder Profile still applies.

Note: the Lead–free paste, flux and profile were used for

evaluation purposes by Littelfuse, based upon industry

standards and practices. There are multiple choices of all

three available, it is advised that the customer explores the

optimum combination for their process as processes vary

considerably from site to site.

Lead–free Re-flow Profile

Figure 10