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C1210C106M4R1C7289 Datasheet(PDF) 8 Page - Kemet Corporation |
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C1210C106M4R1C7289 Datasheet(HTML) 8 Page - Kemet Corporation |
8 / 16 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1020-4 • 6/22/2010 88 Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric) EIA Size Code Metric Size Code Median (Nominal) Land Protrusion (mm) X Y C 1210 3225 1.75 1.14 3.00 1812 4532 2.87 1.35 4.39 2220 5650 4.78 2.08 5.38 Stress Reference Test or Inspection Method Ripple Current Heat Generation ∆T : 20ºC max. Reflow solder the capacitor onto a PC board and apply voltage with 10kHz~1Mhz sine curve. (Ripple voltage must be < rated voltage) Terminal Strength JIS-C-6429 Appendix 1, Note:Force of 1.8kg for 60 seconds. Board Flex JIS-C-6429 Appendix 2, Note:2mm (min) for all except 3mm for C0G. Solderability J-STD-002 Magnification 50X. Conditions: a) Method B, 4 hrs @ 155°C, dry heat @ 235°C b) Method B @ 215°C category 3 c) Method D, category 3 @ 260°C Temperature Cycling JESD22 Method JA-104 1000 Cycles (-55°C to +125°C), Measurement at 24 hrs. +/- 2 hrs after test conclusion. Biased Humidity MIL-STD-202 Method 103 Load Humidity: 1000 hours 85°C/85%RH and Rated Voltage.Add 100K ohm resistor. Measurement at 24 hrs. +/- 2 hrs after test conclusion. Low Volt Humidity:1000 hours 85C°/85%RH and 1.5V.Add 100K ohm resistor. Measurement at 24 hrs. +/- 2 hrs after test conclusion. Moisture Resistance MIL-STD-202 Method 106 t = 24 hours/cycle.Steps 7a & 7b not required.Unpowered. Measurement at 24 hrs. +/- 2 hrs after test conclusion. Thermal Shock MIL-STD-202 Method 107 -55°C/+125°C.Note: Number of cycles required-300, Maximum transfer time-20 seconds, Dwell time-15 minutes.Air-Air. High Temperature Life MIL-STD-202 Method 108 1000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 1.5X rated voltage applied. Storage Life MIL-STD-202 Method 108 150°C, 0VDC, for 1000 Hours. Mechanical Shock MIL-STD-202 Method 213 Figure 1 of Method 213, Condition F. Resistance to Solvents MIL-STD-202 Method 215 Add Aqueous wash chemical - OKEM Clean or equivalent. Soldering Process Recommended Soldering Technique: • Mounting technique is limited to solder reflow only. Recommended Soldering Profile • KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020D.1 Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC-7351 Table 4 – Performance & Reliability: Test Methods and Conditions |
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