data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device. ”

“ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,

GL4800

s Features

3. Radiant flux

4. Epoxy resin package

s Applications

1. Floppy disk drives

2. Optoelectronic switches

*1 Pulse width<=100

µ s, Duty ratio= 0.01

*2 For 3 seconds at the position of 1.8mm from the surface of resin edge.

Parameter

Symbol

Rating

Unit

Power dissipation

P

75

mW

Forward current

50

mA

1A

Reverse voltage

6V

Operating temperature

- 25 to + 85

˚C

Storage temperature

- 40 to + 85

˚C

260

˚C

GL4800

1. Thin type ( Thickness : 1.5mm )

2. Beam angle (

∆θ : TYP. ± 30˚)

(

Φ

e

1.6

2.54

0.8

0.7

2 - C0.5

s Outline Dimensions

(Unit : mm )

(Ta = 25˚C )

s Absolute Maximum Ratings

0.25

1

2

2

1

Parameter

Conditions

MIN.

TYP.

MAX.

Unit

Forward voltage

-

1.2

1.4

V

Peak forward voltage

-

3.0

4.0

V

Reverse current

-

-

10

µ A

Terminal capacitance

-

70

-

pF

Frequency response

-

-

300

-

kHz

Radiant flux

0.7

1.6

3.0

mW

Peak emission wavelength

-

950

-

nm

Half intensity wavelength

-

45

-

nm

s Electro-optical Characteristics

( Ta = 25˚C)

Symbol

λ p

∆λ

Pink transparent

epoxy resin

1 Anode

2 Cathode

Diode

Thin Type Infrared Emitting

φ0.8

2 - 0.45

2 - 0.9