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AP2337 Datasheet(PDF) 3 Page - Diodes Incorporated |
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AP2337 Datasheet(HTML) 3 Page - Diodes Incorporated |
3 / 10 page AP2337 1.0A SINGLE CHANNEL CURRENT-LIMITED LOAD SWITCH AP2337 Document number: DS35060 Rev. 2 - 2 3 of 10 www.diodes.com September 2011 © Diodes Incorporated Recommended Operating Conditions Symbol Parameter Min Max Units VIN Input voltage 2.7 5.5 V IOUT Output Current 0 1.0 A TA Operating Ambient Temperature -40 85 °C Electrical Characteristics (TA = 25 oC, VIN = +5.0V, unless otherwise stated) Symbol Parameter Test Conditions (Note 3) Min Typ. Max Unit VUVLO Input UVLO VIN rising 2.00 2.65 V IQ Input quiescent current Above UVLO, IOUT= 0 65 110 μA IREV Reverse leakage current VIN = 0V, VOUT = 5V, IREV at VIN 0.01 0.1 μA RDS(ON) Switch on-resistance VIN = 5V, IOUT = 1A 110 140 m Ω VIN = 3.3V, IOUT = 1A 140 170 ILIMIT Over-load current limit VIN = 5V, VOUT = 4V, CL=10μF 1.1 1.5 1.9 A IOS Short-circuit current OUT connected to ground, CL=10μF 0.2 0.6 1.0 A TSHORT Short-circuit response time From VOUT < 0.6V to IOUT = 0A (OUT shorted to GND) (See Figure. 1)(Note 7) 5 μs IROCP Reverse current limit Above UVLO 0.3 0.5 0.7 A TTrig Deglitch time from reverse current trigger to MOSFET turn off 0.6 ms VOVP Output over-voltage trip point Above UVLO (Note 4) 110% 120% VIN TOVP Debounce time from output over- voltage to MOSFET turn off 15 μs TON Output turn-on time (Note 5) CL = 1μF, Rload = 5Ω (UVLO to 90% VOUT-NOM) 1 4 ms TDIS Discharge time CL= 1μF, from UVLO to VOUT < 0.3V 500 μs TSHDN Thermal shutdown threshold 150 °C THYS Thermal shutdown hysteresis 20 °C θJA Thermal Resistance Junction-to- Ambient (Note 6) 180 oC/W Notes: 3. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately. 4. During output over-voltage protection, the output draws approximately 60µA current. 5. Since the output turn-on slew rate is dependent on input supply slew rate, this limit is only applicable for input supply slew rate between 5V/0.2ms to 5V/1ms. 6. Device mounted on FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout. 7. Applicable for output voltage slew rate ≤ 5V/30μs. Figure 1. Short Circuit Response Time |
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