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BD3538HFN Datasheet(PDF) 9 Page - Rohm

Part # BD3538HFN
Description  Termination Regulators for DDR-SDRAMs
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Manufacturer  ROHM [Rohm]
Direct Link  http://www.rohm.com
Logo ROHM - Rohm

BD3538HFN Datasheet(HTML) 9 Page - Rohm

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Technical Note
BD3538F,BD3538HFN
9/10
www.rohm.com
2010.05 - Rev.A
© 2010 ROHM Co., Ltd. All rights reserved.
0
100
200
300
400
500
600
700
800
0
25
50
75
100
125
150
Ambient Temperature:Ta(℃)
(2) 560mW
(1) 690mW
100℃
0.0
0.5
1.0
1.5
2.0
0
25
50
75
100
125
150
Ambient Temperature:Ta(℃)
(3) 0.63W
(2) 1.35W
(1) 1.75W
(1) 1 layer (copper foil density : 65%)
θ
ja=71.4℃/W
(2) 1 layer (copper foil density : 7%)
θ
ja=92.4℃/W
(3) 1 layer (copper foil density : 0.2%)
θ
ja=198.4℃/W
Heat Loss
Thermal design must be conducted with the operation under the conditions listed below (which are the guaranteed
temperature range requiring consideration on appropriate margins etc.):
1. Ambient temperature Ta: 100°C or lower
2. Chip junction temperature Tj: 150°C or lower
The chip junction temperature Tj can be considered as follows. See Page 2/10 for θja.
For the package has FIN at the bottoms of IC, package power depends on the connected copper foil area. Be sure to keep
the board surface area or release the heat with setting enough through holes to inside pattern.
Most of heat loss in BD3538F/HFN occurs at the output N-channel FET. The power lost is determined by multiplying the
voltage between VIN and Vo by the output current. As this IC employs the power PKG, the thermal derating characteristics
significantly depends on the pc board conditions. When designing, care must be taken to the size of a pc board to be used.
Power dissipation (W) = {Input voltage (VTT_IN) – Output voltage (VTT=1/2VDDQ)}×Io (Ave)
If VTT_IN = 1.8 volts, VDDQ=1.8 volts, and Io (Ave)=0.5 A, for instance, the power dissipation is determined as follows:
Power dissipation (W) = {1.8 (V) – 0.9 (V)} × 0.5 (A) = 0.4 (W)
Power Dissipation
SOP8
HSON8
(1) 70mm×70mm×1.6mm Glass-epoxy PCB
θ
j-c=181℃/W
(2) With no heat sink
θ
j-a=222℃/W


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