DIMENSIONS

INCHES

MM

DIM

MIN

MAX

MIN

MAX

NOTE

A

.090

.107

2.30

2.70

B

.063

.071

1.60

1.80

C

.045

.053

1.15

1.35

D

.031

.045

0.80

1.15

E

.010

.016

0.25

0.40

G

.004

.018

0.10

0.45

H

.004

.010

0.10

0.25

J

-----

.006

-----

0.15

Features

Surface Mount Package Ideally Suited for Automatic Insertion

For General Purpose Switching Applications

Mechanical Data

Marking : T4

Terminals: Solderable per MIL-STD-202, Method 208

Polarity: Indicated by Cathode Band

Weight: 0.008 grams ( approx.)

1N4148WX

A

B

E

C

J

D

H

G

SOD323

0.022”

0.074"

0.027”

SUGGESTED SOLDER

PAD LAYOUT

High Speed

Switching Diode

500mW

omponents

20736 Marilla

Street Chatsworth



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$%    !"#

MCC

Maximum Ratings @ 25

°C Unless Otherwise Specified

Average Rectified Current

300

(1)

mA

Peak Forward Surge Current t<1S

I

2.0

A

FSM

Power Dissipation

500

mW

Thermal Resistance

315

K/W

Operation/Storage Temp.

Range

-55 to +150

°C

Electrical Characteristics @ 25

°C Unless Otherwise Specified

Maximum Instantaneous

Forward Voltage

1.0V

°C (Note 1)

Maximum DC Reverse

Current At Rated DC

Blocking Voltage

25nA

50

µA

5.0uA

°C

°C

Typical Junction

Capacitance

4pF

Maximum Reverse

Recovery Time

4nS

Ω

Revision: A

2011/01/01

TM

Micro Commercial Components

Moisture Sensitivity: Level 1 per J-STD-020C

1 of 3

Epoxy meets UL 94 V-0 flammability rating

Moisture Sensitivity Level 1

Fast Switching Speed

Lead Free Finish/RoHS Compliant ("P" Suffix

designates RoHS Compliant. See ordering information)

Notes:

1. Valid provided that terminals are kept at ambient temperature

Reverse Voltage

V

75

V

R

Peak Reverse Voltage

V

100

V

RM