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www.rohm.com

2011.01 - Rev.A

© 2011 ROHM Co., Ltd. All rights reserved.

High Performance Regulators for PCs

Nch FET Ultra LDO

for Desktop PCs

BD35281HFN

●

Description

The BD35281HFN ultra low-dropout linear regulator operates from a very low input supply, and offers ideal performance in

low input voltage to low output voltage applications. It incorporates a built-in N-MOSFET power transistor to minimize the

the regulator realizes high current output (Iomax=1.5A) with reduced conversion loss, and thereby obviates the switching

regulator and its power transistor, choke coil, and rectifier diode. Thus, the BD35281HFN designed to enable significant

package profile downsizing and cost reduction. In BD35281HFN, The NRCS (soft start) function enables a controlled output

voltage ramp-up, which can be programmed to whatever power supply sequence is required.

●

Features

1) Internal high-precision reference voltage circuit (0.65V±1%)

2) Internal high-precision output voltage circuit

4) NRCS (soft start) function reduces the magnitude of in-rush current

5) Internal Nch MOSFET driver offers low ON resistance (100mΩ typ)

6) Built-in short circuit protection (SCP)

7) Built-in current limit circuit (1.5A min)

8) Built-in thermal shutdown (TSD) circuit

9) Small package HSON8 : 2.9mm×3.0mm×0.6mm

10) Tracking function

●

Applications

Notebook computers, Desktop computers, LCD-TV, DVD, Digital appliances

●

Absolute maximum ratings (Ta=25℃)

Parameter

Symbol

Ratings

Unit

Input Voltage 1

+6.0 *

1

V

Input Voltage 2

+6.0 *

1

V

Maximum Output Current

2*

1

A

Enable Input Voltage

-0.3～+6.0

V

Power Dissipation 1

Pd1

0.63

*2

W

Power Dissipation 2

Pd2

1.35

*3

W

Power Dissipation 3

Pd3

1.75

*4

W

Operating Temperature Range

Topr

-10～+100

℃

Storage Temperature Range

Tstg

-55～+125

℃

Maximum Junction Temperature

Tjmax

+150

℃

*1 Should not exceed Pd.

*2 Reduced by 5.04mW/℃ for each increase in Ta≧25℃

(when mounted on a 70mm×70mm×1.6mm glass-epoxy board, 1-layer, copper foil area : less than 0.2%)

*3 Reduced by 10.8mW/℃ for each increase in Ta≧25℃

(when mounted on a 70mm×70mm×1.6mm glass-epoxy board, 1-layer, copper foil area : less than 7.0%)

*4 Reduced by 14.0mW/℃ for each increase in Ta≧25℃

(when mounted on a 70mm×70mm×1.6mm glass-epoxy board, 1-layer, copper foil area : less than 65.0%)

No.11030EAT38