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SN74AUP1G80DCKT Datasheet(PDF) 1 Page - Texas Instruments |
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SN74AUP1G80DCKT Datasheet(HTML) 1 Page - Texas Instruments |
1 / 26 page 5 1 V CC D DBV PACKAGE (TOP VIEW) 2 CLK 3 4 GND Q DCK PACKAGE (TOP VIEW) 2 CLK 3 4 GND V CC 5 D Q 1 DRY PACKAGE (TOP VIEW) CLK NC D 6 5 4 2 3 GND Q V CC 1 GND Q 3 4 CLK 2 5 D 6 1 N.C. V CC DSF PACKAGE (TOP VIEW) YZP PACKAGE (TOP VIEW) GND D Q V CC CLK 3 5 2 1 4 A1 B1 C1 A2 C2 YFP PACKAGE (TOP VIEW) GND D Q V CC CLK 3 6 2 1 4 5 N.C. A1 B1 C1 A2 B2 C2 SN74AUP1G80 www.ti.com SCES593E – JULY 2004 – REVISED MAY 2010 LOW-POWER SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP Check for Samples: SN74AUP1G80 1 FEATURES • Available in the Texas Instruments NanoStar™ • Wide Operating VCC Range of 0.8 V to 3.6 V Package • Optimized for 3.3-V Operation • Low Static-Power Consumption • 3.6-V I/O Tolerant to Support Mixed-Mode (ICC = 0.9 mA Max) Signal Operation • Low Dynamic-Power Consumption • tpd = 4.4 ns Max at 3.3 V (Cpd = 4.3 pF Typ at 3.3 V) • Suitable for Point-to-Point Applications • Low Input Capacitance (Ci = 1.5 pF Typ) • Latch-Up Performance Exceeds 100 mA Per • Low Noise – Overshoot and Undershoot <10% JESD 78, Class II of VCC • ESD Performance Tested Per JESD 22 • Ioff Supports Partial-Power-Down Mode – 2000-V Human-Body Model Operation (A114-B, Class II) • Schmitt-Trigger Action Allows Slow Input – 1000-V Charged-Device Model (C101) Transition and Better Switching Noise Immunity at the Input (Vhys = 250 mV Typ at 3.3 V) See mechanical drawings for dimensions. N.C. – No internal connection DESCRIPTION/ORDERING INFORMATION The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see Figure 2). 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 2004–2010, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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