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TJ3964GRS-3.3-3L Datasheet(PDF) 9 Page - HTC Korea TAEJIN Technology Co. |
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TJ3964GRS-3.3-3L Datasheet(HTML) 9 Page - HTC Korea TAEJIN Technology Co. |
9 / 11 page 1A Ultra Low Dropout Linear Regulator TJ3964 Dec. 2009 – Rev. 1.1 - 9 - HTC Output Capacitor The TJ3964 requires a proper output capacitance to maintain stability and improve transient response over current. The ESR of the output capacitor within the limits of 0.5Ω to 10Ω is required. A minimum capacitance value of 22µF of tantalum or aluminum electrolytic capacitor is recommended. In a case of ceramic capacitor, a minimum capacitance value of 10µF is required and additional resistance of minimum 1Ω should be added with the output capacitor in series to maintain its minimum ESR. The resistance and capacitance have to be varied upon the load current. VOUT ADJ GND R2 R1 22µF OUTPUT + - VOUT ADJ GND R2 R1 10µF OUTPUT Additional Resistance Maximum Output Current Capability The TJ3964 can deliver a continuous current of 1A over the full operating junction temperature range. However, the output current is limited by the restriction of power dissipation which differs from packages. A heat sink may be required depending on the maximum power dissipation and maximum ambient temperature of application. With respect to the applied package, the maximum output current of 1A may be still undeliverable due to the restriction of the power dissipation of TJ3964. Under all possible conditions, the junction temperature must be within the range specified under operating conditions. The temperatures over the device are given by: TC = TA + PD X θCA / TJ = TC + PD X θJC / TJ = TA + PD X θJA where TJ is the junction temperature, TC is the case temperature, TA is the ambient temperature, PD is the total power dissipation of the device, θCA is the thermal resistance of case-to-ambient, θJC is the thermal resistance of junction-to-case, and θJA is the thermal resistance of junction to ambient. The total power dissipation of the device is given by: PD = PIN – POUT = (VIN X IIN)–(VOUT X IOUT) = (VIN X (IOUT+IGND)) – (VOUT X IOUT) = (VIN - VOUT) X IOUT + VIN X IGND where IGND is the operating ground current of the device which is specified at the Electrical Characteristics. The maximum allowable temperature rise (TRmax) depends on the maximum ambient temperature (TAmax) of the application, and the maximum allowable junction temperature (TJmax): TRmax = TJmax – TAmax The maximum allowable value for junction-to-ambient thermal resistance, θJA, can be calculated using the formula: θJA = TRmax / PD = (TJmax – TAmax) / PD TJ3964 is available in SOT23-5, SOT-223, TO-252 and SOP-8 packages. The thermal resistance depends on amount of copper area or heat sink, and on air flow. If the maximum allowable value of θJA calculated above is as described in Table 1, no heat sink is needed since the package can dissipate enough heat to satisfy these requirements. If the value for allowable θJA falls near or below these limits, a heat sink or proper area of copper plane is required. |
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