Product Dimensions

PIN 1 & BACKSIDE CHAMFER

4.00

(.157)

0.00 - 0.05

(.000 - .002)

0.80 - 0.95

(.031 - .037)

6.50

(.256)

0.85

(.033)

0.85 ± 0.05

(.033 ± .002)

0.90

(.035)

0.85

(.033)

0.30

(.012)

0.30

(.012)

1.335

(.053)

1.335

(.053)

1.275

(.050)

1.275

(.050)

0.85

(.033)

0.85

(.033)

0.85

(.033)

0.73

(.029)

1.20

(.047)

1.20

(.047)

1.35

(.053)

1.35

(.053)

0.85

(.033)

1.275

(.050)

0.725

(.029)

0.825

(.032)

0.70

(.028)

0.825

(.032)

0.40

(.016)

1.15

(.045)

1.25

(.049)

0.75

(.030)

0.75

(.030)

0.75

(.030)

1.30

(.051)

C

PIN 1

0.25

(.010)

0.40

(.016)

0.70

(.028)

DIMENSIONS:

MM

(INCHES)

Recommended Pad Layout

1

2

3

4

8

7

6

5

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Dark grey areas show added PCB copper area for better

thermal resistance.

Thermal Resistance vs Additional PCB Cu Area

Added Cu Area (Sq. In.)

0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

120

100

80

60

40

20

0

tion finish. For improved thermal dissipation, the recommended

layout uses PCB copper areas which extend beyond the exposed

solder pad. The exposed solder pads should be defined by a

size and spacing. It is recommended that they should be the same

not more than 0.10-0.12 mm (0.004-0.005 in.) smaller in overall

width or length. Solder pad areas should not be larger than the

recommended stencil thickness is 0.10-0.12 mm (0.004-0.005

in.) with a stencil opening size 0.025 mm (0.0010 in.) less than the

solder pad size. Extended copper areas beyond the solder pad

significantly improve the junction to ambient thermal resistance,

resulting in operation at lower junction temperatures with a

corresponding benefit of reliability. All pads should soldered to

the PCB, including pads marked as NC or NU but no electrical

connection should be made to these pads. For minimum parasitic

capacitance, it is recommended that signal, ground or power

signals are not routed beneath any pad.