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667LP2E Datasheet(PDF) 6 Page - Hittite Microwave Corporation |
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667LP2E Datasheet(HTML) 6 Page - Hittite Microwave Corporation |
6 / 8 page For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com 7 7 - 6 Outline Drawing HMC667LP2 / 667LP2E v02.1110 GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 2.3 - 2.7 GHz Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] HMC667LP2 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] 667 XXX HMC667LP2E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] 667 XXX [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 3-Digit lot number XXX Package Information NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN. |
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