GO1525 Data Sheet

21969 - 9

February 2007

7 of 9

4. Handling Recommendations

4.1 Cleaning

There are two options for cleaning the devices.

Option 1:

1. Clean but do not use solvent cleaners.

2. Thoroughly dry assemblies afterwards.

Option 2:

1. Mount device after board is cleaned.

4.2 Storage

Store the devices out of direct sunlight, at a stable temperature and humidity. Avoid

extreme temperatures, high humidity and wide temperature fluctuations.

Condensation on the devices may result in reduced quality and lowered

solderability.

Avoid dust, sea breezes and corrosive gases (Cl

Use within 6 months after delivery. If the devices are stored for more than one year,

solderability may be degraded.

4.3 Transport

Package the devices for transportation to avoid mechanical vibration or shock.

4.4 ESD Warning

Avoid poor ground connections and electrostatic discharge or induction in

production.