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LB1928 Datasheet(PDF) 11 Page - Sanyo Semicon Device |
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LB1928 Datasheet(HTML) 11 Page - Sanyo Semicon Device |
11 / 11 page LB1928 PS No.6197-11/11 SANYO Semiconductor Co.,Ltd. assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein. SANYO Semiconductor Co.,Ltd. strives to supply high-quality high-reliability products, however, any and all semiconductor products fail or malfunction with some probability. It is possible that these probabilistic failures or malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise to smoke or fire, or accidents that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. Upon using the technical information or products described herein, neither warranty nor license shall be granted with regard to intellectual property rights or any other rights of SANYO Semiconductor Co.,Ltd. or any third party. SANYO Semiconductor Co.,Ltd. shall not be liable for any claim or suits with regard to a third party's intellctual property rights which has resulted from the use of the technical information and products mentioned above. Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for volume production. Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the SANYO Semiconductor Co.,Ltd. product that you intend to use. In the event that any or all SANYO Semiconductor Co.,Ltd. products described or contained herein are controlled under any of applicable local export control laws and regulations, such products may require the export license from the authorities concerned in accordance with the above law. No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written consent of SANYO Semiconductor Co.,Ltd. 11. Power supply stabilization Because this IC provides a high output current and uses a switching drive technique, power supply line fluctuations can occur easily. Therefore, a capacitor of sufficient capacitance (several ten µF or higher) must be connected between the VCC pin and ground to assure stable operation. The ground connection of this capacitor must be connected to the GND2 pin, which is the power block ground, at a point as close as possible to the IC. If, due to problems associated with the heat sink, the (electrolytic) capacitor cannot be connected near the this pin, a ceramic capacitor of about 0.1 µF must be connected near the pin. Since the likelihood of power line fluctuation increases if diodes are inserted in the power supply lines to prevent destruction of the IC if power is connected with reverse polarity, a larger capacitance will be required. 12. VREG stabilization A capacitor (about 0.1 µF) must be connected to the VREG pin (the 5V regulator output), which functions as the control circuit power supply, for stabilization. The ground side of this capacitor must be connected to the GND1 pin with a lead that is as short as possible. 13. Integrating amplifier related component values The external components used in the integrating amplifier must be located as close as possible to the IC to minimize the circuit’s susceptibility to noise. These components must be located as far as possible from the motor. This catalog provides information as of December, 2008. Specifications and information herein are subject to change without notice. |
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