EMIF06-MSD02N16

Ordering information

11/12

5.5

Reflow profile

Figure 18.

ST ECOPACK® recommended soldering reflow profile for PCB mounting

Note:

Minimize air convection currents in the reflow oven to avoid component movement.

6

Ordering information

7

Revision history

0

01

2345

67

Time (min)

Temperature (°C)

2°C/s recommended

6°C/s max

220°C

125 °C

260°C max

255°C

180°C

90 sec max

10-30 sec

90 to 150 sec

3°C/s max

0

01

2345

67

Time (min)

Temperature (°C)

2°C/s recommended

6°C/s max

220°C

125 °C

260°C max

255°C

180°C

90 sec max

10-30 sec

90 to 150 sec

3°C/s max

Table 4.

Ordering information

Order code

Marking

Package

Weight

Base qty

Delivery mode

EMIF06-MSDN16

1.

The marking can be rotated by 90° to differentiate assembly location

Micro QFN

6.17 mg

3000

Tape and reel (7”)

Table 5.

Document revision history

Date

Revision

Changes

21-Nov-2008

1

Initial release.