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W25Q64CVZPAP Datasheet(PDF) 5 Page - Winbond |
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W25Q64CVZPAP Datasheet(HTML) 5 Page - Winbond |
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5 / 79 page  W25Q64CV Publication Release Date: April 01, 2011 - 5 - Revision C 1. GENERAL DESCRIPTION The W25Q64CV (64M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down. The W25Q64CV array is organized into 32,768 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q64CV has 2,048 erasable sectors and 128 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.) The W25Q64CV supports the standard Serial Peripheral Interface (SPI), and a high performance Dual/Quad output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 80MHz are supported allowing equivalent clock rates of 160MHz (80MHz x 2) for Dual I/O and 320MHz (80MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (execute in place) operation. A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification with a 64-bit Unique Serial Number. 2. FEATURES • Family of SpiFlash Memories – W25Q64CV: 64M-bit / 8M-byte (8,388,608) – 256-byte per programmable page – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 • Highest Performance Serial Flash – 80MHz Dual/Quad SPI clocks – 160/320MHz equivalent Dual/Quad SPI – 40MB/S continuous data transfer rate – Up to 8X that of ordinary Serial Flash – More than 100,000 erase/program cycles (1) – More than 20-year data retention • Efficient “Continuous Read Mode” – Low Instruction overhead – Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation – Outperforms X16 Parallel Flash • Efficient “Continuous Read Mode” – Single 2.7 to 3.6V supply – 4mA active current, <1µA Power-down (typ.) – -40°C to +85°C operating range • Flexible Architecture with 4KB sectors – Uniform Sector/Block Erase (4/32/64K-bytes) – Program one to 256 bytes – Erase/Program Suspend & Resume • Advanced Security Features – Software and Hardware Write-Protect – Top/Bottom, 4KB complement array protection – Power Supply Lock-Down and OTP protection – 64-Bit Unique ID for each device – Discoverable Parameters (SFDP) Register – 3X256-Byte Security Registers with OTP locks – Volatile & Non-volatile Status Register Bits • Space Efficient Packaging – 8-pin SOIC 208-mil – 8-pad WSON 6x5-mm/8x6-mm (2) – 16-pin SOIC 300-mil – 8-pin PDIP 300-mil – 24-ball TFBGA 8x6-mm – Contact Winbond for KGD and other options Note 1. More than 100,000 Block Erase/Program cycles for Industrial and Automotive temperature; more than 10,000 full chip Erase/Program cycles tested in compliance with AEC-Q100. 2. WSON 8x6-mm is a special order package, please contact Winbond for ordering information. |
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