AN10778

PCB layout guidelines for NXP MCUs in BGA packages

Rev. 2 — 15 April 2011

Application note

Document information

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Content

Keywords

LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x,

LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220, LPC2292,

LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478,

LPC2880, LPC2888, LPC3130, LPC3131, LPC3141, LPC3143,

LPC3152, LPC3154, LPC3180/01, LPC3220, LPC3230, LPC3240,

LPC3250, LH79524, LH7A400, LH7A404, TFBGA100, TFBGA144,

TFBGA208, TFBGA180, TFBGA296, LFBGA208, BGA256, LBGA256,

LFBGA256, LFBGA324, LFBGA320, Layout Guidelines, BGA, PCB, Fan-

out

Abstract

This application note is focused on Printed Circuit Board (PCB) layout

issues when using (L)(LF)(TF)BGA packages from the NXP LPC

Microcontroller family.