TPS84410 datasheet(3/28 Pages) TI1

Part #	TPS84410

Description	2.95-V to 6-V Input, 4-A Synchronous Buck, Integrated Power Solution

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TPS84410

www.ti.com

SLVSAR5

– SEPTEMBER 2011

THERMAL INFORMATION

TPS84410

THERMAL METRIC(1)

RKG39

UNIT

39 PINS

θJA

Junction-to-ambient thermal resistance(2)

12

ψJT

Junction-to-top characterization parameter(3)

2.2

°C/W

ψJB

Junction-to-board characterization parameter(4)

9.7

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The junction-to-ambient thermal resistance,

θJA, applies to devices soldered directly to a 100 mm x 100 mm double-sided PCB with

1 oz. copper and natural convection cooling. Additional airflow reduces

θJA.

(3)

The junction-to-top characterization parameter,

ψJT, estimates the junction temperature, TJ, of a device in a real system, using a

procedure described in JESD51-2A (sections 6 and 7). TJ = ψJT * Pdis + TT; where Pdis is the power dissipated in the device and TT is

the temperature of the top of the device.

(4)

The junction-to-board characterization parameter,

ψJB, estimates the junction temperature, TJ, of a device in a real system, using a

procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB * Pdis + TB; where Pdis is the power dissipated in the device and TB is

the temperature of the board 1mm from the device.

PACKAGE SPECIFICATIONS

TPS84410

UNIT

Weight

0.85 grams

Flammability

Meets UL 94 V-O

MTBF Calculated reliability

Per Bellcore TR-332, 50% stress, TA = 40°C, ground benign

32.8 MHrs

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