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AK4424 Datasheet(PDF) 17 Page - Asahi Kasei Microsystems |
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AK4424 Datasheet(HTML) 17 Page - Asahi Kasei Microsystems |
17 / 19 page ![]() [AK4424] MS0935-E-03 2010/09 - 17 - PACKAGE 0-10 ° Detail A Seating Plane 0.10 0.17 ±0.05 0.22 ±0.1 0.65 *5.0 ±0.1 1.1 (max) A 1 8 9 16 16pin TSSOP (Unit: mm) 0.1 ±0.1 NOTE: Dimension "*" does not include mold flash. 0.13 M ■ Package & Lead frame material Package molding compound: Epoxy Lead frame material: Cu Lead frame surface treatment: Solder (Pb free) plate |
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