Electronic Components Datasheet Search |
|
ADA4830-1BCPZ-R2 Datasheet(PDF) 6 Page - Analog Devices |
|
ADA4830-1BCPZ-R2 Datasheet(HTML) 6 Page - Analog Devices |
6 / 22 page ADA4830-1/ADA4830-2 Data Sheet Rev. C | Page 6 of 22 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating Supply Voltage (+VS Pin) 6 V Supply Voltage Delta +VS1 to +VS2, ADA4830-2 Only 0.5 V Input Voltage Positive Direction (INNx, INPx) 22 V Input Voltage Negative Direction (INNx, INPx) −10 V Reference Voltage (VREFx Pin) +VS + 0.3 V Power Dissipation See Figure 3 Storage Temperature Range −65°C to +150°C Operating Temperature Range −40°C to +125°C Lead Temperature (Soldering, 10 sec) 260°C Junction Temperature 150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the device and its exposed paddle is soldered to a high thermal conductivity, 4-layer (2s2p) circuit board, as described in EIA/JESD 51-7. Table 4. Package Type θJA θJC Unit 8-Lead LFCSP 50 5 °C/W 16-Lead LFCSP 54 6 °C/W MAXIMUM POWER DISSIPATION The maximum safe power dissipation in the ADA4830-1 and ADA4830-2 packages is limited by the associated rise in junction temperature (TJ) on the die. At approximately 150°C, which is the glass transition temperature, the plastic changes its properties. Exceeding a junction temperature of 150°C for an extended time can result in changes in the silicon devices, potentially causing failure. The power dissipated in the package (PD) is the sum of the quiescent power dissipation and the power dissipated in the package due to the load drive for all outputs. The quiescent power is the supply voltage (+VS) times the quiescent current (IS). The power dissipated due to load drive depends on the particular application. The power due to load drive is calculated by multiplying the load current by the associated voltage drop across the device. RMS voltages and currents must be used in these calculations. Airflow increases heat dissipation, effectively reducing θJA. Figure 3 shows the maximum power dissipation in the package vs. the ambient temperature for the 8-lead LFCSP (116°C/W) and the 16-lead LFCSP (54°C/W) on a JEDEC standard 4-layer board. θJA values are approximate. 0 0.5 1.0 1.5 2.0 2.5 3.0 0 10 20 30 40 50 60 70 80 90 100 AMBIENT TEMPERATURE (°C) 16-LEAD LFCSP 8-LEAD LFCSP Figure 3. Maximum Power Dissipation vs. Ambient Temperature for a 4-Layer Board ESD CAUTION |
Similar Part No. - ADA4830-1BCPZ-R2 |
|
Similar Description - ADA4830-1BCPZ-R2 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |