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ADP2370ACPZ-1.2-R7 Datasheet(PDF) 6 Page - Analog Devices |
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ADP2370ACPZ-1.2-R7 Datasheet(HTML) 6 Page - Analog Devices |
6 / 32 page ADP2370/ADP2371 Data Sheet Rev. A | Page 6 of 32 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating VIN to PGND and Ground Plane −0.3 V to +17 V SW to PGND and Ground Plane −0.7 V to VIN + 0.3 V FB to PGND and Ground Plane −0.3 V to +6 V EN to PGND and Ground Plane −0.3 V to +17 V PG to PGND and Ground Plane −0.3 V to +17 V SYNC to PGND and Ground Plane −0.3 V to +17 V FSEL to PGND and Ground Plane −0.3 V to +17 V Temperature Range Storage −65°C to +150°C Operating Ambient −40°C to +85°C Operating Junction −40°C to +125°C Soldering Conditions JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL DATA Absolute maximum ratings apply individually only, not in com- bination. Exceeding the junction temperature (TJ) limit can cause damage to the ADP2370/ADP2371. Monitoring ambient temperature does not guarantee that TJ is within the specified temperature limits. The maximum ambient temperature may require derating in applications with high power dissipation and poor thermal resistance. In applications with moderate power dissipation and low printed circuit board (PCB) thermal resistance, the maximum ambient temperature can exceed the maximum limit as long as the junction temperature is within specification limits. The junction temperature of the device is dependent on the ambient temperature, the power dissipation of the device, and the junction to ambient thermal resistance of the package (θJA). Maximum junction temperature (TJ) is calculated from the ambient temperature (TA) and power dissipation (PD) using the formula TJ = TA + (PD × θJA) Junction-to-ambient thermal resistance (θJA) of the package is based on modeling and calculation using a 4-layer board. θJA is highly dependent on the application and board layout. In applica- tions where high maximum power dissipation exists, close attention to thermal board design is required. The value of θJA can vary, depending on PCB material, layout, and environmental con- ditions. The specified values of θJA are based on a 4-layer, 4 in. × 3 in. circuit board. See JESD 51-7, High Effective Thermal Conduc- tivity Test Board for Leaded Surface Mount Packages, for detailed information on board construction. For more information, see Application Note AN-772, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP). ΨJB is the junction to board thermal characterization parameter with units of °C/W. The ΨJB of the package is based on modeling and calculation using a 4-layer board. The JESD51-12, Guidelines for Reporting and Using Electronic Package Thermal Information, states that thermal characterization parameters are not the same as thermal resistances. ΨJB measures the component power flowing through multiple thermal paths rather than a single path as in thermal resistance, θJB. Therefore, ΨJB thermal paths include convection from the top of the package as well as radiation from the package, factors that make ΨJB more useful in real- world applications. Maximum junction temperature (TJ) is calculated from the board temperature (TB) and power dissipation (PD) using the formula TJ = TB + (PD × ΨJB) For more detailed information regarding ΨJB, see JESD51-12 and JESD51-8, Integrated Circuit Thermal Test Method Envi- ronmental Conditions—Junction-to-Board. THERMAL RESISTANCE θJA and ΨJB are specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. θJC is a parameter for surface-mount packages with top mounted heat sinks. Table 4. Thermal Resistance Package Type θJA θJC ΨJB Unit 8-Lead 3 mm × 3 mm LFCSP 36.7 23.5 17.2 °C/W ESD CAUTION |
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