ADP2370ACPZ-1.2-R7 datasheet(6/32 Pages) AD

Part #	ADP2370ACPZ-1.2-R7

Description	High Voltage, 1.2 MHz/600 kHz, 800 mA

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Manufacturer	AD [Analog Devices]

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6 / 32 page

ADP2370/ADP2371

Data Sheet

Rev. A | Page 6 of 32

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VIN to PGND and Ground Plane

−0.3 V to +17 V

SW to PGND and Ground Plane

−0.7 V to VIN + 0.3 V

FB to PGND and Ground Plane

−0.3 V to +6 V

EN to PGND and Ground Plane

−0.3 V to +17 V

PG to PGND and Ground Plane

−0.3 V to +17 V

SYNC to PGND and Ground Plane

−0.3 V to +17 V

FSEL to PGND and Ground Plane

−0.3 V to +17 V

Temperature Range

Storage

−65°C to +150°C

Operating Ambient

−40°C to +85°C

Operating Junction

−40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in com-

bination. Exceeding the junction temperature (TJ) limit can

cause damage to the ADP2370/ADP2371. Monitoring ambient

temperature does not guarantee that TJ is within the specified

temperature limits. The maximum ambient temperature may

require derating in applications with high power dissipation and

poor thermal resistance.

In applications with moderate power dissipation and low

printed circuit board (PCB) thermal resistance, the maximum

ambient temperature can exceed the maximum limit as long

as the junction temperature is within specification limits. The

junction temperature of the device is dependent on the ambient

temperature, the power dissipation of the device, and the junction

to ambient thermal resistance of the package (θJA).

Maximum junction temperature (TJ) is calculated from the

ambient temperature (TA) and power dissipation (PD) using

the formula

TJ

= TA + (PD × θJA)

Junction-to-ambient thermal resistance (θJA) of the package is

based on modeling and calculation using a 4-layer board. θJA is

highly dependent on the application and board layout. In applica-

tions where high maximum power dissipation exists, close

attention to thermal board design is required. The value of θJA can

vary, depending on PCB material, layout, and environmental con-

ditions.

The specified values of θJA are based on a 4-layer, 4 in. × 3 in.

circuit board. See JESD 51-7, High Effective Thermal Conduc-

tivity Test Board for Leaded Surface Mount Packages, for detailed

information on board construction. For more information, see

Application Note AN-772, A Design and Manufacturing Guide for

the Lead Frame Chip Scale Package (LFCSP).

ΨJB is the junction to board thermal characterization parameter

with units of °C/W. The ΨJB of the package is based on modeling

and calculation using a 4-layer board. The JESD51-12, Guidelines

for Reporting and Using Electronic Package Thermal Information,

states that thermal characterization parameters are not the same

as thermal resistances. ΨJB measures the component power flowing

through multiple thermal paths rather than a single path as in

thermal resistance, θJB. Therefore, ΨJB thermal paths include

convection from the top of the package as well as radiation

from the package, factors that make ΨJB more useful in real-

world applications. Maximum junction temperature (TJ) is

calculated from the board temperature (TB) and power

dissipation (PD) using the formula

TJ

= TB + (PD × ΨJB)

For more detailed information regarding ΨJB, see JESD51-12

and JESD51-8, Integrated Circuit Thermal Test Method Envi-

ronmental Conditions—Junction-to-Board.

THERMAL RESISTANCE

θJA and ΨJB are specified for the worst-case conditions, that is, a

device soldered in a circuit board for surface-mount packages.

θJC is a parameter for surface-mount packages with top mounted

heat sinks.

Table 4. Thermal Resistance

Package Type

θJA

θJC

ΨJB

Unit

8-Lead 3 mm × 3 mm LFCSP

36.7

23.5

17.2

°C/W

ESD CAUTION

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